Embedded Flex Circuit on Leadframe for High-Density IC Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional packaging methods for integrated circuit devices are inadequate in achieving high packaging density and reducing the size of semiconductor devices, as they struggle to efficiently connect and package circuits fabricated on the same or different wafers or chips.
Innovation Solution
The use of a leadframe with an embedded flex circuit, where the flex circuit is mechanically and electrically coupled to the leadframe using adhesive material and conductive traces, allowing for the integration of multiple integrated circuit devices in a densely packed arrangement, with portions of the flex circuit extending beyond the encapsulant material to facilitate additional device connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional packaging methods are used, then the packaging process is simple and well-established, but the packaging density is low and device size is large
Solution Approach 1:
The flex circuit is embedded within the leadframe structure, nesting multiple functional elements (flex circuit with conductive traces and adhesive material) inside the leadframe cavity. This nesting approach increases packaging density by utilizing the internal space of the leadframe rather than adding external components.
Solution Approach 2:
The invention combines multiple functions into a single integrated structure: the leadframe serves as both the mechanical support and the electrical connection structure, while the embedded flex circuit integrates bonding pads and conductive traces. This merging reduces the number of separate components and increases packaging density.
2Quantity of substance
If multiple integrated circuit devices are integrated in a densely packed arrangement, then packaging density increases, but the manufacturing and assembly process becomes more complex
Solution Approach 1:
The flex circuit is pre-assembled with adhesive material and conductive traces before being embedded in the leadframe. The bonding pads are pre-positioned and prepared for wire bonding, allowing subsequent assembly steps to proceed more efficiently despite the increased device density.
Solution Approach 2:
The flex circuit acts as an intermediary structure between the leadframe and the integrated circuit devices. It provides a flexible interface that facilitates wire bonding connections while accommodating the dense packing arrangement, thereby simplifying the overall assembly process despite high device density.
3Area of moving object
If the surface area of the packaged device is reduced, then packaging efficiency improves, but the available space for electrical connections and heat dissipation is limited
Solution Approach 1:
The flex circuit extends beyond the encapsulant material in certain directions, utilizing the vertical and lateral dimensions to provide connection points without increasing the overall device footprint. This dimensional approach allows multiple electrical connections and heat dissipation paths within a compact form factor.
Solution Approach 2:
The flex circuit provides localized areas for electrical connections and heat dissipation at specific positions where needed, rather than requiring uniform distribution across the entire device surface. This allows compact packaging while maintaining necessary connection and thermal management capabilities at critical locations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a more compact and densely packed integrated circuit device configuration, allowing for increased packaging density and reduced surface area occupation, addressing the limitations of traditional packaging techniques.
Implementation Method 1
The flex circuit is mechanically and electrically coupled to the leadframe using adhesive material and conductive traces
Implementation Method 2
The flex circuit is mechanically and electrically coupled to the leadframe using adhesive material and conductive traces
Data Source
AI summary
A device is disclosed which includes a flexible material including at least one conductive wiring trace, a first die including at least an integrated circuit, the first die being positioned above a portion of the flexible material, and an encapsulant material that covers the first die and at least a portion of the flexible material. A method is disclosed which includes positioning a first die above a portion of a flexible material, the first die including an integrated circuit and the flexible material including at least one conductive wiring trace, and forming an encapsulant material that covers the first die and at least a portion of the flexible material, wherein at least a portion of the flexible material extends beyond the encapsulant material.