Embedded Flip-Chip Packaging in Moldable Polymer Substrates
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Solution Overview
Problem
Existing methods for producing electronic components are complex and inefficient, particularly when it comes to creating components with small dimensions and flexible designs.
Innovation Solution
A method involving a moldable substrate, preferably a thin un-crosslinked or partially crosslinked polymer film, where semiconductor chips are applied and then embedded by deforming the substrate, allowing for electrical contacts to remain accessible.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional production methods are used for electronic components, then manufacturing reliability is maintained, but device complexity and production time increase significantly
Solution Approach 1:
The patent combines multiple production steps into a single molding operation. The moldable substrate is deformed to simultaneously encapsulate multiple semiconductor chips and create electrical contacts in one process, eliminating the need for separate mounting and wiring steps used in conventional methods
Solution Approach 2:
The moldable substrate serves multiple functions: it acts as the packaging substrate, the encapsulation material, and the electrical interconnection medium. The deformation of the substrate simultaneously achieves chip embedding and electrical contact formation, making the process universally applicable to various chip types and configurations
2Adaptability or versatility
If conventional rigid substrates are used, then structural stability is achieved, but component flexibility and small dimensions are limited
Solution Approach 1:
The patent changes the physical state of the substrate from rigid to moldable by using a thermoplastic or elastomeric material that can be deformed at elevated temperature and then stabilized upon cooling. This parameter change allows the substrate to be shaped during molding and then maintain its structure during operation
Solution Approach 2:
The moldable substrate is implemented as a thin film or layer that can be deformed into various shapes. After molding, the substrate forms a flexible yet stable encapsulation structure that conforms to the embedded chips while providing mechanical protection and structural integrity
3Productivity
If multiple separate production steps are used, then manufacturing precision is maintained, but productivity decreases
Solution Approach 1:
The moldable substrate is pre-formed with specific geometric features and deformation patterns before the molding process. These preliminary structures guide the chips into precise positions and ensure accurate electrical contact formation during the subsequent deformation step, eliminating the need for post-processing alignment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the production of electronic components, enables the creation of small and flexible components, and provides a cost-effective solution with efficient electrical contacting.
Implementation Method 1
The semiconductor chip is introduced into the moldable substrate by deforming the moldable substrate, such that the semiconductor chip is embedded into the moldable substrate proceeding from the first main surface
Implementation Method 2
During polymerization of the monomers, which is initiated by UV light or heat, for example, the monomers react chemically with one another and form chemical bonds among one another
Data Source
AI summary
In an embodiment a method includes providing a moldable substrate, applying at least one semiconductor chip to a first main surface of the moldable substrate, introducing the semiconductor chip into the moldable substrate by deforming the moldable substrate such that the semiconductor chip is embedded into the moldable substrate proceeding from the first main surface, wherein at least one electrical contact of the semiconductor chip is freely accessible from an outside, wherein the semiconductor chip is a radiation-emitting flip-chip, and wherein a radiation exit surface of the flip-chip is free of electrical contacts, providing a carrier having at least one electrical connection location on a first main surface and applying the carrier to the first main surface of the moldable substrate after introducing the semiconductor chip into the moldable substrate such that the at least one electrical contact of the semiconductor chip is electrically contacted with the electrical connection location.