Embedded Planar Floor Sensor Structure for Faster Installation
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Solution Overview
Problem
Existing floor sensor systems require separate installation of sensors and flooring, which is time-consuming and complex, and have intricate contact arrangements between sensor conductors and connection cables.
Innovation Solution
Integration of planar sensors and flooring into a unitary structure, where conductive sensor areas and conductors are embedded within the flooring layers, allowing for a continuous manufacturing process and simplified installation, with peeling areas for easy electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the sensor is installed separately from the flooring, then the sensor can be independently manufactured and tested, but the installation process becomes time-consuming and complex
Solution Approach 1:
The patent merges the sensor and flooring into a single integrated unit where the sensor is embedded within the flooring structure. This combining eliminates the need for separate installation steps, as the sensor-flooring unit is installed together as one component, directly reducing installation time while maintaining manufacturing flexibility through modular design
2Ease of manufacture
If the sensor is installed separately from the flooring, then the sensor can be independently manufactured, but the installation process becomes complex
Solution Approach 1:
By integrating the sensor into the flooring structure, the patent reduces installation complexity from multiple separate steps (sensor installation + flooring installation + connection making) to a single unified installation process. The sensor is embedded within the flooring layers, eliminating the need for separate mounting and connection procedures
3Reliability
If traditional contact arrangement is used between sensor conductors and connection cable, then electrical connections can be made, but the contact arrangement becomes intricate and complex
Solution Approach 1:
The patent extracts the complex contact arrangement from the traditional sensor system by providing peeling areas in the flooring that expose the sensor conductors. This allows connection cables to be directly attached to the conductors without intricate contact mechanisms, simplifying the electrical connection process while maintaining reliable electrical contact
4Ease of operation
If conductive sensor areas are exposed, then electrical connections can be made, but the sensor areas are vulnerable to mechanical damage
Solution Approach 1:
The patent embeds the conductive sensor areas within the flooring structure, nesting them between flooring layers for protection. The peeling areas provide controlled access points where the flooring is removed to expose conductors for connection, after which the protective flooring structure remains in place to shield the sensor areas from mechanical damage during installation and use
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates straightforward installation of the sensor-flooring unit and simplifies electrical connections, providing enhanced protection against mechanical damage and reducing installation complexity.
Implementation Method 1
the flooring layers and the conductive areas and conductor layers are laminated together
Data Source
AI summary
A planar sensor having a conductor pattern for electric field sensing and its manufacturing method, the planar sensor comprising arrays of planar electrically conductive sensor areas (2) arranged to follow each other in a successive manner along the longitudinal direction, and conductors connecting electrically conductive sensor area to at least one connector, wherein the sensor further comprises a first elastic flooring layer (3) and at least one of the following: a second elastic flooring layer (4) or a flexible circuit board, and the electrically conductive sensor areas (2) and the conductors are attached between the first elastic flooring layer (3) and the second elastic flooring layer (4) or between the first elastic flooring layer (3) and the flexible circuit board to form a unitary floor sensor structure.