Embedded Fluid Conduits for Ion Implanter Thermal Management
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Solution Overview
Problem
Conventional semiconductor manufacturing ion implanters face limitations in uniform cooling due to axial conduit configurations, which restrict thermal management and ion current capacity, particularly for thermally sensitive components like magnets.
Innovation Solution
The use of additive manufacturing processes to create embedded conduits with complex shapes and surface features within semiconductor manufacturing devices, enabling enhanced heating or cooling by forming conduits with unique cross-sections and profiles that allow for more efficient fluid distribution and thermal control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If axial conduit configurations are used for cooling, then the structure is simple to manufacture, but uniform cooling throughout the ion source cannot be achieved
Solution Approach 1:
The patent transitions from simple axial conduits to three-dimensionally winding conduits that navigate through the ion source structure in multiple directions. This dimensional complexity allows the cooling fluid to reach all thermal hot spots uniformly while maintaining integration with the magnet assembly, resolving the contradiction between manufacturing simplicity and cooling uniformity
Solution Approach 2:
The cooling conduits are embedded within the magnet assembly structure itself, with the magnet poles and yoke forming the outer structure that contains the winding conduits. This nesting approach integrates the cooling function directly into the magnetic circuit components, achieving uniform cooling without requiring separate external cooling systems
2Power
If direct anode cooling systems are used, then higher discharge powers can be managed, but thermal damage to the magnet and other components still occurs
Solution Approach 1:
The patent implements localized cooling by placing winding conduits in specific strategic locations within the ion source structure, particularly near thermal hot spots and the magnet assembly. This targeted approach allows heat to be removed from critical areas without requiring the entire system to be cooled, preventing thermal damage to the magnet while enabling higher discharge powers
Solution Approach 2:
The cooling fluid acts as an intermediary that absorbs heat from the ion source plasma and anode regions and transports it away from the magnet assembly. The winding conduit structure enhances this intermediary function by maximizing the cooling fluid's contact area with thermal hot spots, thereby protecting the magnet from thermal damage while allowing higher power operation
3Device complexity
If conventional cooling systems are used, then the device structure is simpler, but ion current capacity is limited due to thermal constraints
Solution Approach 1:
The winding conduit configuration utilizes three-dimensional space within the magnet assembly to create extended cooling pathways. This dimensional approach increases the cooling surface area and fluid circulation efficiency, enabling better thermal management that supports higher ion current capacities without proportionally increasing device complexity
Solution Approach 2:
The patent combines the magnetic circuit components (poles, yoke) with the cooling conduit system into an integrated assembly. This merging allows the cooling function to be embedded within the existing structural components, achieving enhanced ion current capacity through improved thermal management without adding separate complex cooling systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for improved thermal management and uniform temperature distribution within ion implanters, increasing ion current capacity and reducing thermal damage to components, while also reducing the number of parts and potential contamination.
Implementation Method 1
The set of raised surface features may extend into an interior area of the conduit... to affect flow properties of a fluid flowing through the conduit
Implementation Method 2
forming a conduit embedded within a component of a semiconductor manufacturing device using an additive manufacturing process
Data Source
AI summary
Provided herein are approaches for forming a conduit embedded within a component of a semiconductor manufacturing device (e.g., an ion implanter) using an additive manufacturing process (e.g., 3-D printing), wherein the conduit is configured to deliver a fluid throughout the component to provide heating, cooling, and gas distribution thereof. In one approach, the conduit includes a set of raised surface features formed on an inner surface of the conduit for varying fluid flow characteristics within the conduit. In another approach, the conduit may be formed in a helical configuration. In another approach, the conduit is formed with a polygonal cross section. In another approach, the component of the ion implanter includes at least one of an ion source, a plasma flood gun, a cooling plate, a platen, and/or an arc chamber base.