Embedded Field Programmable Module for Interface Bridging
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Solution Overview
Problem
Integrated circuits, such as ASICs, are hardcoded and struggle to meet dynamic feature requirements, leading to increased costs, power consumption, and limited flexibility in communicating with various peripheral devices due to the need for additional external components and customized circuitry.
Innovation Solution
Incorporating field programmable modules like FPGAs and CPLDs within processing systems, allowing for in-system programmability and reconfigurable interface bridging, which reduces the need for fixed components and enables flexible communication protocol adaptation, cost reduction, and enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional external components and customized circuitry are used to facilitate communication between ASIC and external devices, then communication compatibility with different peripheral devices is improved, but cost, power consumption, and board area increase
Solution Approach 1:
The patent merges the field programmable module directly into the ASIC chip, combining what were previously separate external components (ASIC + external FPGAs/CPLDs) into a single integrated device. This integration eliminates the need for multiple external components while maintaining the adaptability benefits of field programmable logic for communication compatibility.
Solution Approach 2:
The field programmable module serves multiple functions: it provides communication protocol adaptation for different peripheral devices, enables board-level reconfiguration, and offers post-manufacturing flexibility. This multi-functionality replaces what would otherwise require multiple specialized external components, reducing overall system complexity.
2Adaptability or versatility
If additional external components are used for interface bridging and I/O expansion, then communication flexibility is improved, but power consumption increases
Solution Approach 1:
By integrating the field programmable module on-chip with the ASIC, the patent eliminates power consumption associated with external components, interconnect power losses, and additional I/O interfaces. The unified architecture reduces overall power consumption while maintaining communication flexibility through the field programmable module.
3Adaptability or versatility
If additional external components are used for interface bridging and I/O expansion, then communication capability is improved, but board area increases
Solution Approach 1:
The patent consolidates the field programmable module and ASIC into a single integrated chip, eliminating the need for separate external FPGAs, CPLDs, and associated support components on the PCB. This integration dramatically reduces board area while preserving communication capability through the embedded field programmable module.
4Manufacturing precision
If hardcoded ASIC design is used, then manufacturing precision is improved, but adaptability to dynamic feature requirements deteriorates
Solution Approach 1:
The patent introduces dynamics into the previously static ASIC design by embedding a field programmable module that can be reconfigured after manufacturing. This allows the system to adapt to dynamic feature requirements while maintaining the manufacturing precision benefits of the hardcoded ASIC core through the hybrid architecture.
5Adaptability or versatility
If external components are used for communication with peripheral devices, then protocol compatibility is improved, but access to main chip registers is limited
Solution Approach 1:
By integrating the field programmable module directly on the ASIC chip, the patent creates direct internal connectivity between the programmable logic and the main chip registers. This eliminates the access limitations of external components and enables full register access capability while maintaining protocol compatibility through the field programmable module's adaptability.
Data Source
AI summary
One or more specialized field programmable modules (e.g. CPLD and FPGA blocks) and their programming interface are embedded into a processing system (e.g. a CPU, GPU, APU and/or chipset). The field programmable modules are in-system programmable, in contrast to the application specific integrated circuit (ASIC) modules that perform the core functions of the processing system. The programmable flexibility of the field programmable modules can have various benefits during different stages of the integrated circuit life cycle for the processing system, such as reconfigurable interface bridging and two-way I/O expansion.