Embedded Glass Cores in Package Substrates for Signal Loss Reduction
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Solution Overview
Problem
Integrated circuit package substrates face challenges in achieving high-speed input/output communication and power delivery while dealing with signal loss and manufacturing limitations of traditional organic core materials, particularly in implementing coaxial magnetic inductors and densely arranged vias.
Innovation Solution
The use of embedded glass cores within organic core substrates allows for smaller drill dimensions and pad sizes, reducing signal loss and enabling higher speeds, while combining with organic cores to facilitate power delivery and simplify handling, and the integration of coaxial magnetic inductors in organic core regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional organic core materials are used in package substrates, then manufacturing and handling are simplified, but signal loss increases and high-speed input/output communication performance deteriorates
Solution Approach 1:
The patent employs a hybrid core structure combining glass core regions and organic core material regions within the same package substrate. The glass core regions provide low signal loss for high-speed input/output communication paths, while the organic core material regions facilitate power delivery and simplify manufacturing processes. This composite approach allows the substrate to simultaneously achieve low signal loss and ease of manufacture by assigning different materials to different functional regions.
2Speed
If smaller drill dimensions and pad sizes are implemented to reduce signal loss, then high-speed communication performance improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies different core materials to different regions based on local functional requirements. Glass core regions are positioned in areas requiring high-speed signal transmission where small drill dimensions and pad sizes are needed, while organic core material regions are positioned in areas requiring power delivery and manufacturing simplicity. This local differentiation allows smaller features to be implemented only where necessary for high-speed performance without imposing stringent precision requirements across the entire substrate.
3Power
If coaxial magnetic inductors are integrated in organic core regions, then power delivery capability improves, but device complexity increases
Solution Approach 1:
The patent divides the substrate core into distinct glass core regions and organic core material regions. Coaxial magnetic inductors are integrated specifically within the organic core material regions where they provide enhanced power delivery capability. This segmentation allows power delivery functions to be concentrated in regions with appropriate material properties while keeping signal transmission regions separate, thereby managing device complexity through functional zoning rather than uniform complexity across the entire substrate.
Data Source
AI summary
Embedded glass cores in package substrates and related methods are disclosed herein including an integrated circuit including a substrate having a first side and a second side opposite the first side, a plurality of vias disposed within the substrate to electrically couple corresponding contacts on the first and second sides of the substrate, a glass core surrounding a first via of the plurality of vias, and an organic core surrounding a second via of the plurality of vias, the second via different than the first via.