Embedded Metal Grid Layer Stack for Continuous Thin-Film PV Coating
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Solution Overview
Problem
Current thin-film photovoltaic manufacturing processes require frequent vacuum breaking, leading to increased operational costs and reduced service life of vacuum turbopumps, as well as interruptions in the deposition of solar module layers, which hinder continuous vacuum coating and increase capital expenditure.
Innovation Solution
A layer stack for thin-film photovoltaic modules with an embedded conductive metal grid, deposited on the buffer/i-layer before or after the P2 structure line, allowing for continuous vacuum coating of the front electrode and interlayer without breaking vacuum, and utilizing a patterned line groove structure to position the metal grid perpendicular to the P1, P2, and P3 structure lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If vacuum coating is used to deposit most solar module layers, then manufacturing precision is improved, but vacuum breaking frequency increases leading to higher operating costs and reduced equipment service life
Solution Approach 1:
The metal grid is printed on the buffer/i-layer before vacuum deposition of subsequent layers, allowing the vacuum environment to be maintained throughout the entire deposition process without breaking for grid formation. This preliminary action eliminates the need for vacuum breaking between buffer/i-layer deposition and front electrode deposition.
Solution Approach 2:
Instead of the conventional approach where the metal grid is deposited after the front electrode (requiring vacuum breaking), this invention inverts the sequence by depositing the metal grid on the buffer/i-layer before front electrode deposition, enabling continuous vacuum operation.
2Reliability
If metal grid printing and P3 structure are performed between vacuum depositions, then electrical connectivity is achieved, but process interruption occurs leading to increased capital expenditure
Solution Approach 1:
The metal grid function is merged into the buffer/i-layer deposition stage, combining grid formation with the vacuum deposition process. This eliminates the need for separate metal grid printing equipment and process steps, reducing capital expenditure while maintaining electrical connectivity.
Solution Approach 2:
The buffer/i-layer serves dual functions: as a functional layer for the photovoltaic device and as a substrate for metal grid deposition. This multi-functionality eliminates the need for separate grid printing equipment, reducing capital expenditure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces capital and operating expenses by enabling continuous vacuum coating processes, minimizing vacuum breaking, and enhancing the efficiency of solar cell production by embedding the metal grid within the layer stack, thus reducing costs and maintaining operational efficiency.
Implementation Method 1
A layer stack for thin-film photovoltaic modules is composed of a back electrode, an absorber, a buffer/i-layer, a front electrode and an interlayer which are sequentially stacked on a corresponding substrate from bottom up by vacuum coating deposition
Implementation Method 2
the metal grid is deposited by different solution deposition methods. Further, the solution deposition method is any of inkjet printing, aerosol printing, screen printing, and electroplating
Data Source
AI summary
A layer stack for thin-film photovoltaic modules includes a back electrode, an absorber, a buffer/i-layer, a front electrode and an interlayer which are sequentially stacked on a corresponding substrate from bottom up by vacuum coating deposition. The layer stack is divided by P1, P2 and P3 structure lines respectively. A conductive metal grid is embedded in the layer stack, and the metal grid is deposited on the buffer/i-layer before or after the P2 structure line. According to the present invention, the conductive metal grid is embedded in the layer stack, and the metal grid is deposited on the buffer/i-layer before or after the P2 structure line, thereby forming an embedded grid, and thus, the front electrode and the interlayer can be deposited without breaking vacuum in the process sequence. The embedded grid reduces capital expenditure and operating cost.