Embedded Ground Shield for Inductor Isolation
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Solution Overview
Problem
Integrated circuit packages face challenges with magnetic and electromagnetic interference, particularly between inductors, which current technologies address by increasing physical separation, leading to increased manufacturing costs and power consumption, with limited isolation effectiveness.
Innovation Solution
The implementation of a microelectronic device package design that includes a shield partially embedded within and surrounding the inductor, comprising metallic plates and an array of vias to limit electromagnetic and magnetic signal transmission, while maintaining a desired quality factor and inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If physical separation between inductors is increased, then electromagnetic interference is reduced, but manufacturing cost and power consumption increase
Solution Approach 1:
A ground shield structure is introduced as an intermediary element between adjacent inductors. The shield comprises a ground plane with conductive traces that create electromagnetic shielding without requiring increased physical separation. This mediator structure blocks electromagnetic fields while allowing compact inductor placement, thereby reducing interference without increasing manufacturing cost or power consumption.
Solution Approach 2:
The solution transitions from solving interference in the horizontal plane (increasing separation distance) to solving it in the vertical dimension (adding ground shields between layers). By utilizing the third dimension with multi-layer PCB construction and embedded ground shields, the patent achieves isolation without increasing the horizontal footprint or separation distance between inductors.
2Object-affected harmful factors
If physical separation between inductors is increased, then electromagnetic interference is reduced, but power consumption increases
Solution Approach 1:
The ground shield acts as an electromagnetic barrier that reduces interference without requiring increased power consumption for signal compensation. By providing passive electromagnetic shielding through the ground plane structure, the system maintains low power operation while achieving the required isolation between inductors.
Solution Approach 2:
The ground plane, which naturally exists in PCB designs for reference potential, is repurposed to provide electromagnetic shielding. This converts an existing structural element into a beneficial shielding mechanism, reducing interference without adding significant power consumption or manufacturing complexity.
3Object-affected harmful factors
If physical separation between inductors is increased, then isolation effectiveness is improved, but package size increases
Solution Approach 1:
The patent utilizes vertical layering with ground shields positioned between inductor layers to achieve isolation without increasing horizontal package dimensions. By moving the isolation mechanism from the planar domain to the vertical domain, compact inductor placement is enabled while maintaining effective electromagnetic isolation.
Solution Approach 2:
The ground shield structure is nested within the existing PCB layer structure, with shields positioned between signal layers containing inductors. This nested arrangement provides shielding functionality without adding external package size, as the shields are integrated within the internal PCB architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces interference between inductors, minimizing power consumption and chip area, while allowing for closer proximity of inductors, thus reducing package size and manufacturing costs.
Implementation Method 1
a shield disposed around at least a portion of a periphery of the component and, together with the first plate and the second plate, to limit transmission of electromagnetic signals to and from the component
Data Source
AI summary
A microelectronic device may include a substrate, a component, a first plate, a second plate, and a shield. The component may be disposed at least partially within the substrate. The first plate may be disposed on a first side of the component. The second plate may be disposed on a second side of the component. The shield may be disposed around at least a portion of a periphery of the component.