Embedded High-Density Substrate Printed Wiring Board
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Solution Overview
Problem
Existing printed wiring boards face challenges in achieving high-density conductor regions while maintaining structural integrity and simplifying manufacturing processes, as they often require complex build-up steps and are prone to conductor density variations.
Innovation Solution
A multilayer printed wiring board design featuring a first substrate with a recess portion and a second substrate inserted into it, where the second substrate has a higher conductor density than the first, allowing for electrical connection and enhanced adhesion through a resin fill, simplifying the manufacturing process and improving structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a single substrate is used with high density conductor regions, then conductor density is improved, but manufacturing complexity and structural integrity deteriorate
Solution Approach 1:
The printed wiring board is divided into multiple substrates with different conductor densities. A first substrate provides mechanical support with lower conductor density, while second substrates with higher conductor density are inserted into recess portions of the first substrate. This segmentation allows each substrate to be optimized for its specific function, simplifying the manufacturing process compared to creating high-density regions on a single substrate.
Solution Approach 2:
Different regions of the printed wiring board have different substrate types inserted into recess portions. High-density second substrates are placed in regions requiring high conductor density, while the first substrate with lower conductor density is used in other regions. This local quality approach allows optimal conductor density in each region without complicating the overall manufacturing process.
2Quantity of substance
If conductor density is increased in a single substrate, then electrical connection density is improved, but structural integrity and impact resistance deteriorate
Solution Approach 1:
The structure is segmented into a first substrate providing mechanical strength and second substrates providing high conductor density. The first substrate acts as a robust base with recess portions, while the second substrates are inserted to provide high-density electrical connections only where needed. This segmentation separates the structural support function from the high-density electrical connection function.
Solution Approach 2:
The printed wiring board uses a composite structure combining first substrates with lower conductor density and second substrates with higher conductor density. These different substrate types are inserted into recess portions to create a composite structure that achieves both high conductor density in specific regions and overall structural integrity through the combination of different substrate properties.
3Quantity of substance
If complex build-up steps are used to achieve high-density regions, then conductor density is improved, but manufacturing process complexity deteriorates
Solution Approach 1:
Instead of using complex build-up steps on a single substrate, the invention segments the manufacturing into separate first and second substrates. The second substrates with high conductor density are manufactured separately and then inserted into recess portions of the first substrate. This segmentation simplifies the manufacturing process by avoiding complex build-up steps while achieving high conductor density.
Solution Approach 2:
The second substrates with high conductor density are prepared in advance as separate components before being inserted into the first substrate. This preliminary action allows the high-density regions to be manufactured optimally as standalone components, then integrated into the final assembly, simplifying the overall manufacturing process compared to building up high-density regions in place.
4Quantity of substance
If high-density conductor regions are formed on a single substrate, then electrical connection density is improved, but reliability and impact resistance deteriorate
Solution Approach 1:
The printed wiring board is segmented into a first substrate that provides impact resistance and reliability, with recess portions containing second substrates that provide high conductor density. This segmentation allows the first substrate to serve as a protective base that absorbs impact, while the second substrates provide high-density electrical connections in a protected, embedded configuration.
Solution Approach 2:
The invention uses a composite structure where first substrates and second substrates with different properties are combined. The first substrates provide mechanical strength and impact resistance, while the second substrates provide high conductor density. This composite approach achieves both high electrical connection density and improved reliability through impact resistance.
Data Source
AI summary
A printed wiring board includes a first substrate having a recess portion and multiple conductors, a second substrate having multiple conductors and inserted in the recess portion of the first substrate such that the first substrate has a surface exposing at least a portion of a surface of the second substrate. The multiple conductors in the first substrate is electrically connected to the multiple conductors in the second substrate, and the second substrate has density of the conductors which is higher than density of the conductors of the first substrate.