Embedded Heat Conducting Element for Thermal Resistance Reduction
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Solution Overview
Problem
Conventional heat dissipation substrates face increased thermal resistance due to the inferior thermal conductivity of insulating layers, which impedes effective heat dissipation from heat-generating elements like LEDs.
Innovation Solution
A heat dissipation substrate with an embedded heat conducting element comprising an insulating material layer and at least one metal layer, where the insulating material layer is filled in a through groove of the substrate to fix the heat conducting element, providing both insulation and high heat dissipation capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating layer is used between circuit layers to achieve insulation, then electrical insulation is improved, but thermal conductivity deteriorates causing increased thermal resistance
Solution Approach 1:
The heat conducting element is segmented into multiple functional layers: an insulating material layer for electrical insulation and metal layers for heat dissipation. This segmentation allows each layer to perform its specific function independently, resolving the contradiction between insulation and heat conduction.
Solution Approach 2:
The heat conducting element uses composite structure combining insulating material and metal materials. The insulating material layer provides electrical insulation while the metal layer provides high thermal conductivity, achieving both insulation and heat dissipation simultaneously.
2Productivity
If heat is transmitted through the insulating layer, then heat dissipation path is maintained, but thermal resistance increases impeding heat dissipation
Solution Approach 1:
The metal layer acts as an intermediary substance between the heat generating element and the insulating layer. It efficiently conducts heat away from the heat generating element while the insulating material layer provides electrical insulation, preventing heat buildup.
Solution Approach 2:
Different regions of the heat conducting element have different thermal properties: the metal layer has high thermal conductivity for efficient heat transmission, while the insulating material layer has low thermal conductivity for electrical insulation. This local differentiation optimizes both heat dissipation and insulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The embedded heat conducting element enhances heat dissipation efficiency, reducing thermal resistance and improving the performance and lifespan of heat-generating elements by effectively transmitting heat away from the substrate.
Implementation Method 1
heat generated by the heat generating element can be transmitted outside via the patterned circuit layers and the insulating layer to be dissipated
Implementation Method 2
the insulating layer has inferior thermal conductivity, when the heat generated by the heat generating element is transmitted outside via the insulating layer, thermal resistance increases
Data Source
AI summary
A heat dissipation substrate includes a substrate, a heat conducting element, an insulating filling material, a first circuit layer, and a second circuit layer. The substrate has a first surface, a second surface opposite the first surface, and a through groove communicating the first surface with the second surface. The heat conducting element is disposed in the through groove. The heat conducting element includes an insulating material layer and at least one metal layer. The insulating filling material is filled in the through groove for fixing the heat conducting element into the through groove. The first circuit layer is disposed on the first surface of the substrate and exposes a portion of the heat conducting element. The second circuit layer is disposed on the second surface of the substrate. The first circuit layer and the metal layer are respectively disposed on two opposite sides of the insulating material layer.