Embedded Heat Dissipation Device in Microelectronic Die
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Solution Overview
Problem
The increasing power density in microelectronic dice leads to elevated junction temperatures, posing a risk of damage, and existing heat dissipation methods are inefficient and space-constrained in thin devices like smartphones and tablets.
Innovation Solution
A heat dissipation device is embedded within the microelectronic die by forming trenches on the back surface and filling them with thermally conductive material, enhancing heat transfer without increasing the die's thickness, and optionally incorporating thermoelectric cooling for efficient heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat spreader/heat sink is attached to the back surface of the microelectronic die, then heat dissipation is improved, but the device thickness increases
Solution Approach 1:
The heat dissipation device is nested within the microelectronic die by forming trenches in the back surface and filling them with thermally conductive material. This embedding approach allows the heat dissipation structure to be contained within the die itself, eliminating the need for external heat sinks and reducing overall device thickness while maintaining effective heat dissipation.
Solution Approach 2:
The invention transitions from a conventional external heat sink attachment (three-dimensional external structure) to a two-dimensional planar embedding approach within the die back surface. By distributing heat dissipation structures across the surface area rather than extending vertically, the solution achieves effective heat dissipation without increasing device thickness.
2Productivity
If power density of integrated circuit components is increased, then productivity is improved, but junction temperature increases
Solution Approach 1:
The heat dissipation device is selectively positioned over high-power density regions (hot spots) within the microelectronic die. By concentrating thermal management resources where they are most needed rather than uniformly distributing them, the invention effectively manages junction temperatures in high-power density areas while optimizing overall device performance.
3Temperature
If a heat dissipation device is embedded within the microelectronic die, then heat transfer area is increased, but device complexity increases
Solution Approach 1:
The heat dissipation device fabrication is merged with the existing microelectronic die manufacturing process. By integrating trench formation and thermally conductive material deposition into the standard fabrication sequence, the invention increases heat transfer area without requiring separate, complex post-processing steps, thereby minimizing additional device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively increases the heat transfer area and reduces temperature risks without adding thickness, while allowing for selective placement over hot spots to optimize thermal performance and cost-effectiveness.
Implementation Method 1
filling them with thermally conductive material, enhancing heat transfer
Implementation Method 2
heat dissipation device embedded within a microelectronic die
Data Source
AI summary
The subject matter of the present application relates to a heat dissipation device that is embedded within a microelectronic die. The heat dissipation device may be fabricated by forming at least one trench extending into the microelectronic die from a microelectronic die back surface, which opposes an active surface thereof, and filling the trenches with at least one layer of thermally conductive material. In one embodiment, the heat dissipation device may be a thermoelectric cooling device.