Embedded Heat Dissipation Structure for Space-Constrained Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As electronic devices become more integrated and perform at higher speeds, the heat generated by components such as integrated circuit chips can impair the operating environment, leading to overheating issues that need to be addressed efficiently.
Innovation Solution
The electronic device incorporates a heat dissipation structure with a housing, a supporting member, and a heat dissipation member featuring a chamber portion and flange portions welded to a seating recess, with specific dimensions and welding marks to enhance heat dispersal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If larger heat dissipation components are included to dissipate heat efficiently, then heat dissipation performance is improved, but structural limitations of the device are exceeded
Solution Approach 1:
The heat dissipation member is nested within the accommodating recess formed in the supporting member, allowing the heat dissipation component to be integrated into the existing structural space rather than adding external volume. The chamber portion of the heat dissipation member fits precisely within the recess, maximizing heat dissipation efficiency while respecting device volume constraints.
Solution Approach 2:
The heat dissipation member utilizes the vertical dimension by extending from the first surface toward the second surface of the supporting member through the accommodating recess. This vertical arrangement allows effective heat dissipation in the thickness direction of the device, optimizing heat transfer without increasing the device's planar footprint.
2Reliability
If heat dissipation components are added to prevent overheating, then operating environment is improved, but device complexity increases
Solution Approach 1:
The heat dissipation member is merged with the supporting member through the welding connection at the flange portion. The supporting member provides both structural support and houses the heat dissipation function through its accommodating recess, combining multiple functions into integrated components rather than separate assemblies.
Solution Approach 2:
The supporting member serves dual purposes: providing mechanical support for the device components and housing the heat dissipation member through its accommodating recess. This multi-functionality reduces the need for additional dedicated heat dissipation structures, thereby simplifying the overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described structure effectively moves and dissipates heat generated in a narrow area, creating a better operating environment by improving heat management within the device.
Implementation Method 1
at least one flange portion extending from at least a portion of an edge of the chamber portion and welded to a bottom surface of the seating recess
Implementation Method 2
heat dissipation member including a chamber portion at least partially accommodated in the accommodating recess or the accommodating hole
Data Source
AI summary
An electronic device according to one embodiment of the present disclosure, comprises: a housing including a first surface and a second surface that faces away from the first surface; a support member accommodated in the housing between the first surface and the second surface, the support member including an accommodating recess or an accommodating hole formed at a first depth from one of both faces and a seating recess provided in at least a portion of the circumference of the accommodating recess or the accommodating hole on any one surface of the support member; and a heat dissipation member including a chamber portion, which is at least partially accommodated in the accommodating recess or the accommodating hole, and at least one flange portion, which extends from at least a portion of the edge of the chamber portion so as to be welded to the bottom surface of the seating recess, wherein the seating recess is recessed at a second depth that is less than the first depth from any one surface of the support member. Other various embodiments are possible.