Embedded Heat Pipe Interface for Satellite Thermal Panels

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Solution Overview

Problem

Existing thermal systems for Earth-orbiting communication satellites face challenges in efficiently transferring heat between passive thermal panels without occupying external space, which limits component mounting and complicates post-manufacturing thermal coupling.

Innovation Solution

The implementation of an embedded interface within passive thermal panels allows for internal heat pipe coupling between adjacent panels, using an internal channel to receive and compress a non-resident heat pipe, enabling efficient heat transfer without external real estate usage and allowing thermal coupling after panel manufacturing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If external jumper heat pipes are used to couple adjacent passive thermal panels, then heat transfer between panels is enabled, but external panel space is occupied and component mounting is limited

Engineering Contradiction:
Improveheat transfer between panelsVSAvoidexternal panel space
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The jumper heat pipe is nested within an internal channel of the passive thermal panel, allowing the heat transfer function to be integrated inside the panel structure rather than occupying external space. The channel is specifically dimensioned to receive the jumper heat pipe, creating a nested configuration that resolves the space conflict.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The internal channel acts as an intermediary structure that facilitates the integration of the jumper heat pipe within the panel. This mediator enables the heat transfer function while keeping the external surface free for component mounting.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If bolted interfaces are used to attach jumper heat pipes to panels, then secure thermal coupling is achieved, but the interface complexity increases and manufacturing becomes more difficult

Engineering Contradiction:
Improvethermal couplingVSAvoidpanel assembly
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The bolted interface mechanism is extracted from the panel assembly process. Instead of requiring bolts and nuts during manufacturing, the jumper heat pipe is simply inserted into the internal channel and retained by friction and compression, eliminating the need for additional fastening components and simplifying assembly.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The internal channel design provides self-retaining functionality through friction and compression forces. The jumper heat pipe remains securely coupled without external fasteners, allowing the structure to self-maintain the thermal connection through its geometric design rather than requiring additional mechanical fastening systems.

Inventive Principle:
Principle #25Self-service

3Reliability

If thermal interface material is applied between heat pipe flanges, then heat transfer efficiency is improved, but the assembly process becomes more complex and time-consuming

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidassembly speed
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The thermal interface material application step is extracted from the assembly process. The direct contact between the jumper heat pipe and resident heat pipe through the internal channel eliminates the need for additional thermal interface materials, thereby simplifying the assembly process and increasing productivity.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The thermal coupling function is merged directly into the structural design of the internal channel. The channel walls provide both mechanical retention and thermal conduction pathways, combining structural and thermal functions into a single integrated feature that eliminates separate thermal interface requirements.

Inventive Principle:
Principle #5Merging (Combining)

4Reliability

If heat pipes are embedded within passive thermal panels, then thermal management is improved, but post-manufacturing thermal coupling between panels becomes difficult

Engineering Contradiction:
Improvethermal managementVSAvoidpost-manufacturing assembly
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The internal channel is pre-formed within the passive thermal panel during manufacturing, creating a ready-receiver structure that anticipates future thermal coupling needs. This preliminary preparation enables simple post-manufacturing assembly of adjacent panels through straightforward insertion of jumper heat pipes without requiring complex post-assembly operations.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances heat transfer efficiency while freeing up external panel space for component mounting and simplifies the thermal coupling process, improving the overall thermal management of satellites.

Implementation Method 1

Heat input (i.e., from heat-generating electronics) causes the working fluid to evaporate. The evaporated fluid carries the heat towards a colder heat-output section, where heat is rejected as the fluid condenses.

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 2

Heat input (i.e., from heat-generating electronics) causes the working fluid to evaporate.

Methodology Applied
Scientific EffectEvaporation: Evaporation

Implementation Method 3

The evaporated fluid carries the heat towards a colder heat-output section, where heat is rejected as the fluid condenses.

Methodology Applied
Scientific EffectCondensation: Condensation

Implementation Method 4

The condensate returns to the heat input section (near to heat-generating components) by capillary forces to complete the cycle.

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 5

an arrangement that imparts a compressive force to the non-resident heat pipe (once received by the channel) that urges it against the resident heat pipe

Methodology Applied
Scientific EffectCompressive force: Compression

Data Source

PatentUS9908643B2Passive thermal system providing an embedded interface for heat pipes
Publication Date: 2018.03.06 WORLDVU SATELLITES LTD
  • US9908643B2 patent drawing
  • US9908643B2 patent drawing
  • US9908643B2 patent drawing

AI summary

A passive thermal system for use in aerospace vehicles includes a first passive thermal panel having at least one internal resident heat pipe, wherein the first passive thermal panel is further configured to provide an embedded interface between a portion of the resident heat pipe and at least one heat pipe extending from a neighboring passive thermal panel. The embedded interface is facilitated via an internal channel that is adjacent to the internal resident heat pipe. The channel is dimensioned and arranged to receive a portion of a heat pipe extending from a passive thermal panel that will be situated adjacent to the first passive thermal panel. The embedded interface is also facilitated by an arrangement that imparts a compressive force to the non-resident heat pipe that urges it against the resident heat pipe.