Embedded Heat Pipe Satellite Radiator Structure
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Solution Overview
Problem
Satellites face challenges in managing heat generated by electronic components, which can lead to unacceptable temperature rises due to the complexity and mass of existing thermal dissipation systems, particularly in space environments where heat management is more difficult than on Earth.
Innovation Solution
A three-dimensional passive thermal radiator structure is implemented, using embedded heat pipes to thermally and structurally couple radiator panels, reducing the need for external thermal coupling and minimizing additional parts, thereby enhancing thermal efficiency and manufacturing simplicity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional thermal dissipation systems are used in satellites, then heat can be dissipated, but the mass and complexity of the system increase
Solution Approach 1:
The patent merges the thermal dissipation function with the structural support function by integrating heat pipes directly into the radiator panel structure. The heat pipes are embedded within the panel thickness, eliminating the need for separate external thermal coupling components and reducing overall system complexity while maintaining effective heat dissipation.
Solution Approach 2:
The radiator panel structure serves multiple functions simultaneously: it provides structural support for the satellite, acts as a thermal dissipation surface, and incorporates heat pipes for heat transport. This multi-functionality reduces the number of separate components needed, thereby reducing mass and complexity while maintaining thermal management capability.
2Temperature
If traditional thermal dissipation systems are used in satellites, then heat can be dissipated, but the mass of the system increases
Solution Approach 1:
By combining the heat pipe with the radiator panel structure, the patent eliminates the need for separate external thermal coupling components. The heat pipes are embedded within the panel, reducing the total number of parts and thereby reducing the overall mass of the thermal dissipation system while maintaining effective heat removal capability.
3Temperature
If external thermal coupling is used between radiator panels, then thermal connection is achieved, but additional parts and assembly steps are required
Solution Approach 1:
The patent integrates the thermal coupling function directly into the radiator panel structure by embedding heat pipes within the panel thickness. This eliminates the need for separate external thermal coupling components and reduces assembly steps, as the heat pipes are already incorporated during panel manufacturing rather than requiring post-assembly operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates heat from satellites by reducing the number of components and assembly steps, improving thermal efficiency and reducing mass and complexity, while maintaining structural support without external thermal interfaces.
Implementation Method 1
embedded heat pipes to thermally and structurally couple radiator panels
Implementation Method 2
embedded heat pipes with minimal exposed portions between the panels thermal coupling
Data Source
AI summary
A radiator structure for a satellite is provided. A first radiator panel adapted to be positioned on a first side of a central body, and a second radiator panel adapted to be positioned on a second side of the central body. Other implementations include a third radiator panel positioned on a third side of the central body. The apparatus also includes at least one heat pipe embedded between a first face and a second face of each radiator panel and extending from the first radiator panel through the first radiator panel and through the second radiator panel. The heat pipe structurally supports the first radiator panel and the second radiator panel relative to the intermediate radiator panel. A method of manufacturing a radiator structure is also provided.