Embedded Heat Dissipation Plate in Component Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There is a demand for improving heat dissipation in electronic component-incorporating substrates.
Innovation Solution
The electronic component-incorporating substrate includes a first substrate, a second substrate, a spacer member, an electronic component, a heat dissipation plate, and an encapsulation resin. The heat dissipation plate is disposed between the first and second substrates, and at least both surfaces of the heat dissipation plate are embedded in the encapsulation resin, with the heat dissipation plate not overlapping the spacer member in plan view.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a spacer member is used to maintain distance between substrates, then structural stability is improved, but heat dissipation performance deteriorates due to insulation
Solution Approach 1:
The spacer member has different thermal conductivity in different regions: an insulating portion with low thermal conductivity positioned away from the semiconductor chip to maintain structural stability, and a conductive portion with high thermal conductivity positioned near the chip to enable heat dissipation. This local differentiation resolves the contradiction between structural stability and heat dissipation performance.
2Temperature
If the heat dissipation plate is embedded in encapsulation resin, then heat dissipation efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The heat dissipation plate is positioned and fixed to the substrate before the encapsulation resin is formed. This preliminary positioning allows the encapsulation resin to naturally embed the heat dissipation plate during the molding process, simplifying the overall manufacturing process while achieving effective heat dissipation.
3Temperature
If the heat dissipation plate overlaps the spacer member, then heat dissipation path is improved, but electrical insulation is compromised
Solution Approach 1:
The spacer member has asymmetric thermal conductivity distribution with a conductive portion extending toward the semiconductor chip and an insulating portion positioned away from the chip. This asymmetric design allows the heat dissipation plate to overlap the conductive portion for improved heat dissipation while the insulating portion maintains electrical insulation between substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration efficiently dissipates heat generated in the semiconductor chip by transferring it through the encapsulation resin to the heat dissipation plate and dissipating it externally, thereby improving heat dissipation performance and limiting temperature increases in the semiconductor chip.
Implementation Method 1
efficiently dissipates heat generated in the semiconductor chip by transferring it through the encapsulation resin to the heat dissipation plate
Data Source
AI summary
An electronic component-incorporating substrate includes a first substrate, a second substrate arranged above the first substrate, a spacer member electrically connecting the first substrate and the second substrate, an electronic component mounted on the first substrate and disposed between the first substrate and the second substrate, a heat dissipation plate disposed between the first substrate and the second substrate, and an encapsulation resin filling a gap between the first substrate and the second substrate and encapsulating the electronic component. The encapsulation resin includes a first outer side surface. At least both of an upper surface and a lower surface of the heat dissipation plate are embedded in the encapsulation resin. The heat dissipation plate does not overlap the spacer member in plan view. The heat dissipation plate includes a second outer side surface exposed from the first outer side surface of the encapsulation resin.