Embedded Multi-Layer Heat Slug for Low-Warpage Laminate Substrates
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Solution Overview
Problem
Ceramic packages with metallic bases for GaN HEMT transistors require complex and expensive PCB designs due to the need for a cutout and heatsink, complicating assembly and increasing costs.
Innovation Solution
An electronic device with a laminate substrate featuring a multi-layered heat slug, comprising copper layers with varying thermal conductivities and expansion coefficients, and a copper-molybdenum core layer, to optimize thermal dissipation and minimize stress and warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If ceramic packages with metallic base are used for thermal dissipation, then thermal dissipation efficiency is improved, but PCB design complexity and assembly cost increase
Solution Approach 1:
The patent merges the heat slug structure directly into the PCB substrate by embedding copper heat slugs within the PCB layers during manufacturing. This integration eliminates the need for separate ceramic packages with metallic bases, thereby maintaining thermal dissipation efficiency while simplifying PCB design and reducing assembly complexity.
Solution Approach 2:
The PCB substrate is designed to serve multiple functions: it provides both structural support and integrated thermal dissipation pathways. The embedded copper heat slugs serve as both electrical conductors and thermal management components, eliminating the need for separate ceramic package structures and reducing overall device complexity.
2Temperature
If ceramic packages with metallic base are used for thermal dissipation, then thermal dissipation efficiency is improved, but manufacturing cost increases
Solution Approach 1:
The heat management function is merged into the PCB manufacturing process itself. Copper heat slugs are embedded within the PCB layers using standard PCB fabrication techniques, eliminating the need for separate ceramic package manufacturing and assembly operations. This integration reduces manufacturing steps and overall production cost while maintaining effective thermal dissipation.
Solution Approach 2:
The invention uses standard copper materials and conventional PCB manufacturing processes instead of expensive ceramic packages. The embedded copper heat slugs provide adequate thermal dissipation for the application, offering a cost-effective alternative to premium ceramic solutions without requiring specialized manufacturing equipment or processes.
3Stability of the object's composition
If multi-layered heat slug with copper-molybdenum core is used, then stress and warpage are reduced, but manufacturing complexity increases
Solution Approach 1:
The heat slug structure uses different materials (copper and copper-molybdenum) in different regions to optimize local properties. The copper-molybdenum core layer provides lower thermal expansion and stress characteristics, while the copper outer layers provide high thermal conductivity. This localized material differentiation reduces overall stress and warpage while maintaining manufacturability through layer-by-layer construction.
Solution Approach 2:
The heat slug employs a composite structure combining copper and copper-molybdenum layers. This composite material approach allows the structure to benefit from both materials' properties: copper's high thermal conductivity and copper-molybdenum's low thermal expansion. The layered composite structure reduces stress and warpage while remaining compatible with standard PCB manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminate substrate with a copper-molybdenum heat slug provides efficient thermal dissipation, reduces stress and warpage, and simplifies PCB integration, lowering manufacturing costs while preserving device lifetime and performance.
Implementation Method 1
The heat slug includes a top layer having a first thermal conductivity and a first thermal expansion coefficient, a bottom layer having a second thermal conductivity and a second thermal expansion coefficient, and a core layer having a third thermal conductivity
Implementation Method 2
The third thermal expansion coefficient is less than the first thermal expansion coefficient and the second thermal expansion coefficient
Data Source
AI summary
The disclosure is directed to an electronic device with an embedded multi-layered heat slug. The electronic device in includes a substrate having a substrate body with a laminate layer. The substrate further includes a heat slug embedded within the substrate body. The heat slug includes a top layer having a first thermal conductivity and a first thermal expansion coefficient, a bottom layer having a second thermal conductivity and a second thermal expansion coefficient, and a core layer having a third thermal conductivity and a third thermal expansion coefficient. The third thermal conductivity is less than the first thermal conductivity and the second thermal conductivity, and the third thermal expansion coefficient is less than the first thermal expansion coefficient and the second thermal expansion coefficient. In certain embodiments, the top layer and the bottom layer comprise copper, and the core layer comprises copper-molybdenum.