Embedded Heat Spreader and Thermal Vias for Multi-Layer Chip Packages
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Solution Overview
Problem
Multi-layer embedded chip packages with low thermal conductivity and sparsely-distributed metal interconnects present high thermal resistance, making it difficult to efficiently dissipate heat from high-power components like power amplifiers and microprocessors.
Innovation Solution
Incorporating a heat spreader with thermal vias extending through build-up layers to improve heat conduction, where thermal vias are strategically placed under heat-generating devices and the heat spreader is made of materials like copper or ceramics to enhance heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multi-layer embedded chip packages use low thermal conductivity dielectric layers with sparsely-distributed metal interconnects, then manufacturing complexity is reduced and ease of manufacture is improved, but thermal resistance increases significantly making heat dissipation difficult
Solution Approach 1:
The patent introduces a heat spreader as an intermediary component between the heat-generating module and the substrate. This heat spreader acts as a thermal mediator that collects heat from the module and redistributes it through thermal vias to the substrate, effectively lowering the thermal resistance without complicating the manufacturing process of the embedded chip package itself
Solution Approach 2:
The patent employs composite thermal management structures combining different materials with complementary properties: the heat spreader uses high thermal conductivity materials (such as copper or aluminum), while the build-up layers use conventional dielectric materials. This composite approach allows the system to achieve low thermal resistance in critical paths while maintaining the manufacturing advantages of standard dielectric materials in other areas
2Temperature
If thermal vias are strategically placed under heat-generating devices with high thermal conductivity materials, then heat dissipation efficiency is improved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The patent applies local quality by concentrating thermal management resources (thermal vias and heat spreader) specifically under and near the heat-generating module where they are most needed, rather than uniformly distributing them throughout the entire package. This localized approach improves heat dissipation efficiency while minimizing the overall complexity of the structure
Solution Approach 2:
The thermal management function is segmented into distinct components: the heat spreader layer, the thermal via structures, and the build-up layers. This segmentation allows each component to be optimized independently for its specific function while maintaining relative simplicity in the overall device architecture
3Power
If high-power amplifiers and microprocessors are stacked on multi-layer structures, then power density and functionality are improved, but overheating occurs due to insufficient heat transfer paths
Solution Approach 1:
The heat spreader serves as a thermal intermediary that enables high-power components to be stacked on multi-layer structures by providing an efficient heat collection and distribution mechanism. It mediates between the high heat generation from stacked power amplifiers and microprocessors and the heat dissipation capacity of the substrate, preventing overheating while maintaining high power density
Solution Approach 2:
The patent addresses heat dissipation by adding a vertical dimension to the thermal management architecture through the heat spreader layer and thermal vias extending through multiple layers. This three-dimensional thermal pathway enables efficient heat removal from stacked high-power components, allowing increased power density without overheating
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces thermal resistance, enabling efficient heat dissipation from high-power components and allowing for the stacking of power amplifiers and microprocessors on these structures without overheating issues.
Implementation Method 1
a plurality of thermal vias thermally coupled to the heat spreader and extending to the top and bottom build-up layers... improving heat conduction
Implementation Method 2
an embedded heat spreader... significantly reduces thermal resistance, enabling efficient heat dissipation
Data Source
AI summary
A multi-layer structure (102) includes a first build-up layer structure (202) configured to connect to a heat-generating module (120), a second build-up layer structure (206) configured to connect to a substrate, and a middle layer (204) provided between the first build-up layer structure and the second build-up layer structure, the middle layer including at least one semiconductor component (110) and a heat spreader (130). A first set of thermal vias (210) extend through the first build-up layer structure to the heat spreader, and a second set of thermal vias (2100 extend through the second build-up layer structure to the heat spreader, wherein at least a portion of the first set of thermal vias is in thermal contact with the heat-generating module.