Embedded Heating Element Curing Thermohardening Glue
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Solution Overview
Problem
Misalignment of fluid ejectors in fluid ejection devices can cause inaccuracies during droplet ejection, often due to warping of components caused by heating during the curing process.
Innovation Solution
A heating element is embedded in thermohardening glue between the mounting frame and the fluid ejection module, allowing the glue to cure without heating the entire fluid ejector, thus preventing warping and maintaining alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If thermohardening glue is heated for curing, then the glue cures faster, but the entire fluid ejector heats up causing warping and misalignment
Solution Approach 1:
The heating process is segmented into localized zones using multiple heating elements positioned at specific locations (front, center, and rear portions) rather than heating the entire fluid ejector uniformly. This allows selective curing of glue in different sections without causing overall warping.
Solution Approach 2:
Different regions of the fluid ejector are subjected to different thermal conditions - localized heating areas where glue needs curing versus cooler areas where sensitive components are located. This creates local quality variations in temperature distribution to achieve both fast curing and prevent warping.
2Stability of the object's composition
If the fluid ejector is heated uniformly, then the glue cures evenly, but components warp and misalignment occurs
Solution Approach 1:
The uniform heating approach is replaced with segmented heating using multiple independent heating elements positioned at specific locations. This allows the glue to cure evenly through distributed heating while preventing concentrated thermal stress that causes warping.
Solution Approach 2:
Heating elements are embedded within the glue layers themselves, acting as intermediaries that transfer heat directly to the glue from the interior rather than from external sources. This internal heating method ensures even curing without creating temperature gradients that lead to warping.
3Reliability
If heating time is extended to ensure complete curing, then the glue cures thoroughly, but production time increases
Solution Approach 1:
Heating elements are pre-positioned and embedded in the glue layers before final assembly, and heating begins immediately upon assembly without requiring prolonged external heating. This preliminary preparation enables rapid curing while ensuring complete bonding.
Solution Approach 2:
The heating process is made continuous and efficient through embedded heating elements that maintain optimal temperature throughout the curing period. This eliminates the need for extended heating times while ensuring thorough curing, as heat is continuously applied at the right locations without interruption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures faster curing of the glue without warping the components, improving alignment and resulting in greater consistency and accuracy of fluid droplet ejection.
Implementation Method 1
A heating element is embedded in thermohardening glue between the mounting frame and the fluid ejection module
Implementation Method 2
applying heat to a thermohardening glue that is between the fluid ejection module and the mounting frame, and curing the glue to secure the fluid ejection module to the mounting frame
Data Source
AI summary
A method of forming a fluid ejector includes positioning a fluid ejection module such that it is adjacent to a mounting frame, applying heat to a thermohardening glue that is between the fluid ejection module and the mounting frame, and curing the glue to secure the fluid ejection module to the mounting frame. The heat is applied with a heating element at least partially embedded in the glue.