Embedded Heating Element for Adhesive Bond Release

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Solution Overview

Problem

The challenge lies in disassembling and servicing mobile computing devices that are permanently bonded with glue, as external heat and mechanical force can damage sensitive components, and existing solutions require significant operator knowledge and specialized tools.

Innovation Solution

A mechanically embedded heating element is integrated into the glue or adjacent to it, allowing for external or internal activation to facilitate easy disassembly and assembly without damaging components, using materials like Nichrome or Constantan for efficient heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of repair

If external heat and mechanical force are applied to disassemble permanently bonded devices, then the bonding strength is overcome and components can be separated, but component damage occurs and operator expertise is required

Engineering Contradiction:

Improvedisassembly easeVSAvoidcomponent damage

Core Design Contradiction:

Ease of repairVSObject-affected harmful factors

Solution Approach 1:

A heating element is embedded within the adhesive layer during manufacturing, preparing the system in advance for controlled disassembly. The heating element is positioned and connected to wiring before the adhesive cures, so that when disassembly is needed, heat can be immediately applied from within the bond line without requiring external heat sources or specialized tools.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The embedded heating element acts as an intermediary that converts electrical energy to thermal energy directly at the adhesive interface. This intermediary mechanism allows for precise, localized heating of the adhesive layer without exposing surrounding components to harmful external heat or mechanical force, enabling safe and controlled disassembly.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of repair

If external heat sources and specialized tools are used for disassembly, then bonding can be broken, but device complexity increases and operator knowledge requirements increase

Engineering Contradiction:

Improvedisassembly capabilityVSAvoidtool requirements

Core Design Contradiction:

Ease of repairVSDevice complexity

Solution Approach 1:

The heating element is merged with the adhesive layer during the manufacturing process, combining two separate functions (bonding and controlled release) into a single integrated system. The heating element wiring is routed through or alongside the adhesive layer, eliminating the need for separate external heating devices, specialized tools, and complex disassembly procedures.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The device becomes self-serviceable regarding disassembly, as the embedded heating element allows technicians to simply apply electricity to break the bond without requiring external heat sources, specialized mechanical tools, or extensive training. The system provides its own means for controlled disassembly.

Inventive Principle:

Principle #25Self-service

3Strength

If adhesive is used to permanently bond components, then structural integrity is improved and aesthetics are enhanced, but upgradeability and serviceability are limited

Engineering Contradiction:

Improvebonding strengthVSAvoidserviceability

Core Design Contradiction:

StrengthVSAdaptability or versatility

Solution Approach 1:

The bonding system transitions from a static, permanent bond to a dynamic, controllable bond. The adhesive provides strong structural integrity during normal operation, but when electrical heat is applied, the bond can be temporarily weakened or broken, allowing components to be separated. This dynamic characteristic enables both strong bonding and future serviceability.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The physical state or properties of the adhesive are changed through thermal energy application. By controlling the temperature parameter of the adhesive layer using the embedded heating element, the adhesive transitions from a strong bonding state to a softened or melted state, enabling component separation while maintaining strong bonding under normal conditions.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables fast and safe disassembly and reassembly of computing devices, reducing component damage and the need for external heat sources, improving reusability and lowering service costs by eliminating the requirement for complex tools and jigs.

Implementation Method 1

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Implementation Method 2

using materials like Nichrome or Constantan for efficient heat transfer

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3314353B1Mechanically embedded heating element

Publication Date: 2023.05.31 INTEL CORP

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Figure 2A~2B
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AI summary

Methods and apparatus relating to provision and/or utilization of a mechanically embedded heating element are described. An embodiment includes a heating element which is thermally coupled to an adhesive. The adhesive bonds a first item and a second item. The heating element is capable of being heated in response to application of power and the heated heating element causes the release of a bond by the adhesive to allow for physical separation of the first item and the second item. Other embodiments are also disclosed and claimed.