Embedded Thermal Heatsinks for FPGA Hotspot Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Field programmable gate arrays (FPGAs) face increased thermal resistance and higher local temperatures due to high power and thermal density in serializer/deserializer circuitry and input/output circuitry, which poses a significant challenge for heat management.
Innovation Solution
Incorporating thermal heatsinks within integrated circuit packages, specifically within integrated circuit dies and interposers, that utilize conductive regions and vias to transfer heat away from hotspots to the package substrate, improving thermal conductivity and reducing temperatures by 2-3° Celsius.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high power density circuitry is used in FPGAs, then functionality and performance are improved, but thermal resistance increases and local temperatures rise
Solution Approach 1:
The patent extends thermal management from two-dimensional surface cooling to three-dimensional subsurface cooling by placing heatsinks beneath hotspots at different depths within the FPGA structure, allowing heat to be extracted from multiple vertical levels simultaneously
Solution Approach 2:
The patent implements localized heatsinks positioned specifically beneath high-power circuit regions rather than uniform cooling across the entire device, matching the thermal management structure to the spatial distribution of heat-generating circuitry
2Temperature
If traditional external heatsinks are used, then heat can be dissipated, but thermal resistance remains high and hotspot temperatures are not sufficiently reduced
Solution Approach 1:
The patent embeds heatsinks within the internal structure of the FPGA package, nesting thermal management components inside the device housing rather than attaching them externally, thereby reducing thermal resistance through closer proximity to heat sources
Solution Approach 2:
The patent introduces thermal vias and conductive structures as intermediary elements that facilitate heat transfer from hotspot regions to subsurface heatsinks, creating an efficient thermal conduction path through the FPGA substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation of thermal heatsinks effectively reduces hotspot temperatures in FPGAs, enhancing thermal management and conductivity across 2.5D and 3D integrated circuit packages.
Implementation Method 1
Heat is transferred from hotspots in the integrated circuit die (e.g., serializer/deserializer circuitry and/or input/output circuitry) to the interposer through the thermal heatsink
Data Source
AI summary
An electronic device includes a first layer and a thermal heatsink that comprises a conductive region in a second layer of the electronic device. The thermal heatsink further comprises a first via that extends through the first layer. The first via is filled with conductive material that is coupled to the conductive region. The conductive material in the first via is coupled to an external terminal of the electronic device. The electronic device can also include a second via filled with conductive material that is coupled to the conductive region.