Embedded High-Density Substrate Printed Wiring Board
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Solution Overview
Problem
Existing printed wiring boards face challenges in efficiently integrating high-density and low-density conductor regions within a single substrate, leading to complex manufacturing processes and potential reliability issues due to stress and impact sensitivity.
Innovation Solution
A printed wiring board structure comprising a rigid multilayer board with a first substrate and a second substrate, where the second substrate has a higher conductor density, is embedded within the first substrate, using insulative materials and resin to enhance adhesion and shock absorption, while simplifying the build-up process and easing stress on the higher-density substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If high-density and low-density conductor regions are integrated in a single substrate, then conductor density is improved, but manufacturing complexity increases
Solution Approach 1:
The invention divides the printed wiring board into multiple substrates with different conductor densities. A first substrate contains low-density conductors while a second substrate contains high-density conductors. These substrates are arranged in different regions of the rigid multilayer board, allowing each substrate to be optimized for its specific density requirement without complicating the overall manufacturing process.
Solution Approach 2:
The invention applies local quality by creating regions with different conductor densities within the same rigid multilayer board. The first substrate region has low conductor density suitable for certain connections, while the second substrate region has high conductor density for other connections. This allows each region to have the appropriate quality characteristics for its specific function.
2Reliability
If multiple substrates with different conductor densities are integrated, then connection reliability is improved, but device complexity increases
Solution Approach 1:
The invention merges multiple substrates with different conductor densities into a single rigid multilayer board structure. The first substrate with low-density conductors and the second substrate with high-density conductors are both integrated into the same rigid multilayer board, allowing them to work together as a unified system while maintaining their individual density characteristics.
Solution Approach 2:
The invention uses a nested structure where the first and second substrates are embedded within the rigid multilayer board. The substrates are positioned in different regions of the rigid multilayer board, creating a nested arrangement that allows multiple density regions to coexist within a single structural framework, improving connection reliability without excessive complexity.
3Reliability
If high-density conductor regions are formed, then electrical performance is improved, but stress sensitivity increases
Solution Approach 1:
The invention creates local quality variations by placing high-density conductor regions (second substrate) and low-density conductor regions (first substrate) in different areas of the rigid multilayer board. This spatial separation allows high-density regions to achieve superior electrical performance while the overall structure can better manage stress distribution, as not all regions require the same conductor density.
Solution Approach 2:
The invention segments the conductor density requirements into separate substrates. The second substrate provides high-density conductors for critical electrical performance areas, while the first substrate provides low-density conductors for areas where stress management is more important. This segmentation allows each region to be optimized for its specific requirements.
Data Source
AI summary
A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors of the first substrate. The conductors of the second substrate have an existing density which is set higher than an existing density of the conductors of the first substrate, and the first substrate and/or the second substrate is embedded in the rigid multilayer board.