Embedded IC Thermal Management via Substrate Fluid Conduits
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Solution Overview
Problem
Integrated circuit devices embedded in substrates face thermal management challenges due to the lack of exposed surfaces for heat dissipation, leading to potential damage and failure, as traditional heat dissipation methods are inefficient in thin metal layers and reduce performance when throttling is used.
Innovation Solution
Incorporating a heat transfer fluid conduit within the substrate, lined with metallization, to facilitate heat removal from both surfaces of the integrated circuit device, allowing for efficient thermal management without increasing package thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If integrated circuit devices are embedded in substrates to decrease package thickness, then package thickness is reduced, but heat dissipation capability deteriorates due to lack of exposed surfaces
Solution Approach 1:
The patent transitions from traditional surface-mounted heat dissipation to subsurface heat dissipation by embedding cooling channels within the substrate. This dimensional shift allows heat removal from the embedded IC device through the substrate interior, maintaining thin package profile while enabling effective thermal management through a different spatial dimension.
Solution Approach 2:
The cooling channels are nested within the substrate structure itself, with the substrate serving as both the mounting platform for the IC device and the housing for the thermal management system. This nested configuration eliminates the need for separate external cooling components that would increase package thickness.
2Temperature
If thermal throttling control is used to reduce operating temperature, then temperature is reduced, but device performance deteriorates
Solution Approach 1:
The patent introduces a heat transfer fluid as an intermediary medium between the IC device and the external environment. This fluid circulates through embedded channels, actively transporting heat away from the device, thereby maintaining optimal operating temperatures without requiring performance-reducing thermal throttling.
3Use of energy by moving object
If low-power integrated circuit devices are used to reduce heat generation, then power consumption is reduced, but device capability deteriorates
Solution Approach 1:
The patent converts the harmful effect of heat generation into a manageable parameter by implementing an active cooling system. This allows high-power IC devices to operate at full capability while the cooling system handles the thermal byproduct, effectively transforming the heat issue from a limiting factor into a controlled aspect of device operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively manages heat dissipation from embedded integrated circuit devices, preventing damage and maintaining performance by allowing heat transfer fluid to flow through channels within the substrate, thereby maintaining the integrity and functionality of the integrated circuit package.
Implementation Method 1
a first surface of the at least one integrated circuit device is thermally attached to the heat transfer fluid conduit
Implementation Method 2
heat transfer fluid conduit extending though the substrate... allowing heat transfer fluid to flow through channels within the substrate
Data Source
AI summary
An integrated circuit structure may be formed having a substrate, at least one integrated circuit device embedded in and electrically attached to the substrate, and a heat transfer fluid conduit extending through the substrate. In one embodiment, the heat transfer fluid conduit may be lined with a metallization within the substrate. In a further embodiment, the heat transfer fluid conduit may comprise multiple fluid channels for the removal of heat from multiple surfaces of the at least one integrated circuit device. In still a further embodiment, the substrate may include a molded layer, wherein at least one fluid channel is formed in the molded layer.