Embedded IC Heat Dissipation Structure for Thin Substrates
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Solution Overview
Problem
Integrated circuit devices embedded in substrates face thermal management challenges due to the absence of exposed surfaces for heat dissipation, leading to potential damage and failure, as traditional heat dissipation methods are inefficient in thin metal layers and reduce performance when throttling is used.
Innovation Solution
A heat dissipation device with a portion extending into the substrate and another portion external to it, formed from metallization within the substrate and external materials like copper, silver, or gold, to effectively manage thermal contact and prevent material migration through a barrier layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If integrated circuit devices are embedded in substrates to decrease package thickness, then package thickness is reduced, but heat dissipation capability deteriorates due to absence of exposed surfaces
Solution Approach 1:
The heat dissipation device transitions from traditional planar heat spreaders to three-dimensional structures extending into the substrate. The device includes a first portion extending into the substrate to contact the embedded integrated circuit device and a second portion extending above the substrate surface, creating vertical heat dissipation pathways that overcome the limitations of thin-package embeddings.
Solution Approach 2:
The heat dissipation device is nested within the substrate structure, with the first portion embedded in the substrate and the second portion extending outward. This nested configuration allows the heat dissipation functionality to be integrated within the package thickness rather than adding external bulk.
2Temperature
If traditional heat dissipation devices are used with embedded devices, then heat dissipation is improved, but device complexity increases due to additional components and assembly steps
Solution Approach 1:
The heat dissipation device merges the functions of thermal contact, heat conduction, and structural support into a single integrated component. The first portion provides thermal contact with the embedded device, while the second portion extends for additional heat dissipation, eliminating the need for separate heat spreaders or cooling assemblies.
Solution Approach 2:
The heat dissipation device serves multiple functions: it provides thermal contact with the embedded integrated circuit device, conducts heat away from the device, and maintains structural integrity within the substrate. This multi-functional design reduces the need for additional specialized components.
3Device complexity
If metal layers within substrate are used for heat dissipation, then device integration is improved, but heat dissipation efficiency deteriorates due to thinness of metal layers
Solution Approach 1:
The heat dissipation device extends in the vertical dimension both into and above the substrate, creating a three-dimensional heat conduction pathway. This vertical extension provides significantly greater heat dissipation surface area and thermal mass compared to thin planar metal layers, while maintaining high integration within the substrate structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient thermal management of embedded integrated circuit devices, preventing overheating and maintaining performance without increasing package thickness, while compensating for thermal expansion and material migration issues.
Implementation Method 1
a heat dissipation device in thermal contact with the integrated circuit device, wherein a first portion of the heat dissipation device extends into the substrate
Implementation Method 2
preventing material migration through a barrier layer
Implementation Method 3
compensating for thermal expansion and material migration issues
Data Source
AI summary
An integrated circuit structure may be formed having a substrate, at least one integrated circuit device embedded in and electrically attached to the substrate, and a heat dissipation device in thermal contact with the integrated circuit device, wherein a first portion of the heat dissipation device extends into the substrate and wherein a second portion of the heat dissipation device extends over the substrate. In one embodiment, the heat dissipation device may comprise the first portion of the heat dissipation device formed from metallization within the substrate.