Embedded IC Package in PCB Substrate Opening
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Solution Overview
Problem
Multi-chip module (MCM) packages often have large surface areas or tall heights due to the arrangement of integrated circuit (IC) chips, which can result in increased size and thickness of electronic devices, posing challenges in meeting size and thickness requirements for devices like smartphones and laptops.
Innovation Solution
A printed circuit board (PCB) substrate with an opening portion is designed to accommodate an IC package, including an interposer with IC chips on both sides and conductive components for electrical coupling, allowing the IC package to fit into the PCB substrate, reducing the overall thickness of the assembled PCB.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple IC chips are placed side by side to form a multi-chip module, then the functional capability is improved, but the surface area and thickness of the package increase
Solution Approach 1:
The IC package is nested within a recess portion of the PCB substrate. The package includes an interposer with IC chips mounted on both sides, and this entire assembly is inserted into a recess in the PCB, allowing the package to be 'nested' within the board structure rather than adding to its external dimensions. This resolves the contradiction by maintaining functional capability while reducing overall package volume.
Solution Approach 2:
The patent transitions from a planar arrangement of IC chips to a three-dimensional configuration where chips are mounted on both sides of an interposer and the package is embedded in the PCB substrate. This dimensional change allows multiple chips to be integrated without increasing the PCB's surface area or thickness, as the package occupies a recess rather than extending outward.
2Adaptability or versatility
If IC chips are stacked to increase functional capability, then the adaptability is improved, but the package height increases
Solution Approach 1:
The stacked IC chips mounted on both sides of the interposer are nested within a recess portion of the PCB substrate. This nesting arrangement allows the height of the stacked chips to be accommodated within the PCB's thickness rather than increasing the overall package height, thus maintaining functional capability while controlling the stationary dimension.
Solution Approach 2:
The interposer serves as an intermediary component that enables stacking of IC chips on both sides while maintaining a compact profile. The interposer provides the structural platform for mounting chips on its first and second sides, and this intermediate structure is then integrated into the PCB substrate, mediating between the stacked chips and the PCB to reduce overall height.
3Length of stationary object
If the IC package is integrated into the PCB substrate with an opening portion, then the thickness is reduced, but the manufacturing complexity increases
Solution Approach 1:
A recess portion is formed in the PCB substrate before the IC package is mounted. This preliminary action of creating the recess allows the package to be inserted and integrated smoothly, reducing the need for complex post-processing or adjustment steps. The recess is prepared in advance to match the package dimensions, simplifying the overall assembly process despite the added structural complexity.
4Reliability
If conductive components are added to electrically couple the IC package to the PCB substrate, then the electrical connectivity is improved, but the assembly complexity increases
Solution Approach 1:
The conductive components for electrical coupling are merged with the IC package structure itself. The package includes conductive components that are integrated into its design, allowing electrical connection to the PCB substrate without requiring separate, independent coupling elements. This merging reduces assembly complexity by combining multiple functions into a single integrated structure while maintaining reliable electrical connectivity.
Data Source
AI summary
Aspects of the disclosure provide a circuit that includes a printed circuit board (PCB) substrate formed with an opening portion that is dimensioned to accommodate an integrated circuit (IC) package. When the IC package is disposed in the opening portion and is electrically coupled to the PCB substrate for PCB assembling, a thickness of the assembled PCB is less than a thickness sum of the IC package and the PCB substrate.