Embedded Semiconductor IC Resin Substrate for Ultrathin Circuit Boards
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Solution Overview
Problem
Conventional circuit boards incorporating semiconductor ICs face challenges in achieving thinness due to the presence of a core layer, which makes it difficult to embed the IC without compromising its holding and thermal stability.
Innovation Solution
A resin substrate with a core section and a housing section filled with the same resin, where the semiconductor IC is embedded, eliminating the need for a core above and below it, and using a single wiring layer on one surface to minimize thickness and prevent thermal deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a semiconductor IC is mounted on a surface of the circuit board, then the electrical connection is achieved, but the circuit board thickness cannot be reduced
Solution Approach 1:
The invention extracts the core layer from beneath the semiconductor IC, creating a localized removal zone. This allows the IC to be embedded in a recessed portion of the resin substrate without the core layer interfering, thereby reducing overall board thickness while maintaining IC holding capability through the recess structure
Solution Approach 2:
The invention transitions from surface mounting (2D plane) to embedded mounting within the resin substrate (3D space). By creating a recessed portion and embedding the IC within the resin, the design moves the IC from the surface dimension into the thickness dimension, enabling thinner board profiles
2Length of stationary object
If the core layer below the semiconductor IC is removed to reduce thickness, then the circuit board becomes thinner, but the semiconductor IC cannot be appropriately held
Solution Approach 1:
The invention segments the resin substrate into distinct regions: a core section with core material and a housing section without core material. The housing section forms a recessed portion that specifically accommodates the semiconductor IC, providing localized holding capability while allowing core layer removal in other areas to reduce overall thickness
Solution Approach 2:
The invention applies different structural qualities to different regions of the circuit board. The core section maintains the core layer for structural support, while the housing section beneath the IC is designed as a recessed portion with enhanced holding features. This local differentiation provides IC holding capability exactly where needed without compromising overall board thinness
3Stability of the object's composition
If different materials are used for core section and housing section, then structural requirements are met, but thermal expansion differences cause deformation
Solution Approach 1:
The invention uses the same resin material for both the core section and the housing section of the resin substrate. This material homogeneity ensures uniform thermal expansion characteristics throughout the substrate, preventing deformation caused by differential thermal expansion between different material regions while maintaining structural integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the creation of an ultrathin circuit board with reduced risk of warping or cracking, as the resin substrate's uniform thermal expansion properties ensure the IC's stability and ease of electrical connection.
Implementation Method 1
the resin with which the core section is impregnated is the same as the resin that fills the housing section. Therefore, deformation or the like that is attributable to a difference in thermal expansion coefficient or the like does not occur
Data Source
AI summary
Disclosed herein is a manufacturing method of a circuit board. The manufacturing method includes a first step for preparing a prepreg in which a core material is impregnated with an uncured resin. The prepreg has a through-hole surrounded by the core material and the resin so as to penetrate through the core material and the resin. The manufacturing method further includes a second step for housing a semiconductor IC in the through-hole, and a third step for pressing the prepreg so that a part of the resin flows into the through-hole to allow the semiconductor IC housed in the through-hole to be embedded in the resin.