Embedded Inductor via Penetrating Hole Magnetic Core
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Solution Overview
Problem
The miniaturization and increased functionality of electronic devices have led to a decrease in externally mounted electronic components on printed wiring boards, necessitating innovative methods for integrating inductor components without increasing the number of insulation layers, which is challenging due to warping issues and the need for enhanced inductance.
Innovation Solution
An inductor device for printed wiring boards is created by forming a magnetic core structure within a penetrating hole in an insulation layer, surrounded by a conductor layer with inductor patterns, and additional magnetic body layers are formed to enhance magnetic permeability, allowing for higher inductance without increasing the number of layers, thus reducing warping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of insulation layers is increased to accommodate inductor components, then the inductance can be enhanced, but the printed wiring board experiences warping and the overall thickness increases
Solution Approach 1:
The patent transitions from increasing the number of insulation layers (vertical stacking) to forming a magnetic core structure within a penetrating hole through the insulation layer (vertical integration). The inductor pattern is formed on the insulation layer surrounding the magnetic core structure, creating a three-dimensional configuration that achieves high inductance without adding more insulation layers, thus preventing warping.
2Reliability
If more insulation layers are added to achieve desired inductance values, then the inductance requirement can be met, but the manufacturing complexity and process difficulty increase
Solution Approach 1:
The patent embeds the magnetic core structure within a penetrating hole formed through the insulation layer, and surrounds it with the inductor pattern on the insulation layer. This nested configuration integrates the magnetic core and conductor into a compact three-dimensional structure, achieving high inductance without increasing the number of insulation layers or overall device complexity.
3Reliability
If externally mounted inductor components are used, then the desired inductance can be achieved, but the electronic devices cannot be miniaturized
Solution Approach 1:
The patent merges the inductor component with the printed wiring board by forming the inductor pattern directly on the insulation layer of the board and integrating the magnetic core structure within a penetrating hole. This integration eliminates the need for separate externally mounted inductor components, achieving miniaturization while maintaining the desired inductance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the integration of high-inductance inductor components into thin printed wiring boards with fewer layers, minimizing warping and maintaining desired inductance values while simplifying the manufacturing process.
Implementation Method 1
a magnetic core structure including a magnetic material filled in the first penetrating hole through the insulation layer
Implementation Method 2
a conductor layer formed on the insulation layer and having an inductor pattern such that the inductor pattern is surrounding the circumference of the magnetic core structure
Data Source
AI summary
A printed wiring board includes an insulation layer having a first penetrating hole penetrating through the insulation layer, a magnetic core structure including a magnetic material filled in the first penetrating hole through the insulation layer such that the magnetic core structure including a first magnetic body layer formed in the first penetrating hole is formed through the insulation layer, and a conductor layer formed on the insulation layer and having an inductor pattern such that the inductor pattern is surrounding a circumference of the magnetic core structure. The magnetic core structure and the inductor pattern of the conductor layer form an inductor device.