Embedded Inductor in InFO Packaging
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Solution Overview
Problem
The increasing miniaturization of semiconductor chips and the need for more integrated functions pose challenges in packaging, where limited I/O pad areas and solder ball size constraints hinder the integration of high-performance inductors, leading to issues with power management and magnetic interference in voltage regulators.
Innovation Solution
The integration of inductors within Integrated Fan-out (InFO) packaging structures, using a ferromagnetic core and metal layers in an encapsulation material, allows for lower resistance, higher inductance per unit area, and reduced magnetic interference by decoupling inductor manufacturing from chip manufacturing, enabling flexible and cost-effective power management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If inductors are integrated within InFO packaging structures using ferromagnetic core and metal layers, then inductance per unit area increases and resistance decreases, but manufacturing complexity increases due to multi-layer embedding processes
Solution Approach 1:
The inductor structure is nested within the InFO packaging layers, with the ferromagnetic core embedded in encapsulation material and metal layers forming coils around it. This nesting approach allows the inductor to be integrated into the existing packaging structure without requiring separate discrete components, thereby increasing inductance density while managing complexity through hierarchical integration.
Solution Approach 2:
The inductor utilizes composite construction combining ferromagnetic core material with metal layer coils and encapsulation material. This composite approach enables optimized magnetic properties and electrical performance, achieving high inductance per unit area by leveraging the complementary characteristics of different materials in a unified structure.
2Reliability
If discrete inductors are used with voltage regulator ICs, then power management functionality is achieved, but magnetic interference increases and space consumption increases
Solution Approach 1:
The inductor and voltage regulator IC are merged into a single integrated package structure. The inductor is formed within the same packaging substrate using embedded metal layers and ferromagnetic cores, eliminating the need for separate discrete inductor components. This integration reduces magnetic interference by minimizing loop areas and physical separation distances between magnetic fields and sensitive circuitry.
3Productivity
If semiconductor chips are miniaturized to increase integration density, then productivity increases, but available area for I/O pads and inductor integration decreases
Solution Approach 1:
The inductor design transitions from planar two-dimensional layouts to three-dimensional embedded structures within the packaging layers. By utilizing vertical stacking of metal layers and embedding ferromagnetic cores in encapsulation material, the inductor achieves high inductance values without occupying excessive chip surface area, thereby maintaining integration density while providing sufficient space for I/O pads.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient power management with reduced resistance and increased inductance, while minimizing magnetic interference and allowing for the integration of inductors in smaller form factors, enhancing the performance and yield of semiconductor packaging.
Implementation Method 1
a ferromagnetic core embedded in the encapsulation material
Implementation Method 2
A plurality of metal layers are provided in the encapsulation material forming an inductor coil extending around the ferromagnetic core so as to form an inductor
Data Source
AI summary
An inductor is formed in an IC device packaging structure. The structure includes an encapsulating material, with a ferromagnetic core in the encapsulation material. A plurality of metal layers are provided in the encapsulation material forming an inductor coil extending around the ferromagnetic core so as to form an inductor.