Embedded Inductor Inlay With Magnetic Layer Stack for High Inductance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional approaches for component carriers face challenges in achieving high inductance values while maintaining mechanical robustness, electrical reliability, and cost-efficiency, especially in the context of increasing miniaturization and the need for efficient electromagnetic interference shielding.
Innovation Solution
The integration of a magnetic layer stack with an electrically conductive structure in the form of a coil-like inductor element, where the magnetic layers are stacked and the inductor element is embedded within, providing a high inductance value and robust mechanical support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional approaches are used to integrate magnetic material in component carriers, then inductance can be provided, but the inductance values are low and production costs are high
Solution Approach 1:
The patent embeds the electrically conductive coil structure within the magnetic layer stack, nesting the inductor element inside the magnetic material. This integration allows the magnetic layers to directly enhance the inductance of the embedded coil, achieving high inductance values while using a compact, cost-effective manufacturing process that combines multiple functions in a single integrated structure
Solution Approach 2:
The patent creates a composite structure by combining electrically conductive material (for the coil) with magnetic material (the magnetic layers) in a single integrated inductor inlay. This composite approach allows the magnetic layers to amplify the magnetic field generated by the coil, significantly increasing inductance value while maintaining manufacturing efficiency through unified production
2Volume of moving object
If miniaturization of electronic components is pursued, then component density increases, but heat removal becomes increasingly difficult
Solution Approach 1:
The magnetic layer stack serves multiple functions simultaneously: it provides magnetic enhancement for inductance, acts as a thermal management structure due to its layered construction that can conduct heat away from the embedded coil, and offers mechanical support. This multi-functionality addresses miniaturization challenges by integrating thermal management into the inductor structure itself
3Adaptability or versatility
If the number of electronic components with small spacing is increased, then functionality increases, but electromagnetic interference protection becomes increasingly critical
Solution Approach 1:
The patent converts the magnetic field generated by the inductor into a beneficial shielding mechanism. The magnetic layer stack not only enhances inductance but also creates a controlled magnetic environment that can shield sensitive components from external electromagnetic interference, turning the inductor's operational magnetic field into a protective barrier
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the creation of component carriers with enhanced magnetic inductance, improved mechanical robustness, and efficient electromagnetic interference shielding, while maintaining cost-effectiveness and design flexibility.
Implementation Method 1
an electrically conductive structure embedded in the magnetic layer stack, wherein the electrically conductive structure is configured as an inductor element
Implementation Method 2
a magnetic layer stack, comprising a plurality (in particular two, three, or more) of interconnected magnetic layers
Data Source
Figure 1~4
Figure 5a~6c
Figure 7a~8
AI summary
It is described an inductor inlay (150), comprising: i) a magnetic layer stack (160), comprising a plurality of interconnected magnetic layers (161, 162); and ii) an electrically conductive structure (120) embedded in the magnetic layer stack (160), wherein the electrically conductive structure (120) is configured as an inductor element (120) that comprises a coil-like shape. Further, a component carrier and a manufacturing method are described.