Embedded Inductor with Perpendicular Patterned Magnetic Layer
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Solution Overview
Problem
Embedded inductor devices face reduced inductance and quality factor due to parasitic effects when integrated into substrates, limiting their performance in high-frequency applications, and conventional methods struggle to effectively integrate high-permeability magnetic materials into integrated passive devices.
Innovation Solution
A patterned magnetic layer with high permeability is directly contacted by the conductive coil, with the patterned magnetic layer being substantially perpendicular to the conductive coil at any crossover, enhancing inductance and quality factor by concentrating the induced magnetic flux and reducing magnetic hysteresis loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If inductor devices are embedded into a substrate, then circuit area is reduced, but inductance and quality factor are reduced due to substrate loss
Solution Approach 1:
The patent applies local quality by introducing a patterned magnetic layer with high permeability only in specific regions where the conductive coil is located. This localized approach enhances inductance and quality factor at the coil positions without requiring the entire substrate to have magnetic properties, thus maintaining circuit area reduction while improving electrical performance locally.
Solution Approach 2:
The patent uses composite materials by combining the substrate material with a patterned magnetic layer having different magnetic permeability properties. This composite structure allows the substrate to maintain its mechanical and electrical functions while the magnetic layer specifically addresses the inductance and quality factor issues through its high permeability characteristics.
2Reliability
If bulk magnetic material is introduced into inductor coil, then inductance is increased, but integration into IPDs and fabrication processes is difficult
Solution Approach 1:
The patent segments the magnetic material into a patterned layer structure rather than using bulk magnetic material. This segmentation allows the magnetic material to be deposited as thin films in specific patterns using standard semiconductor fabrication techniques, making integration into IPDs and compatibility with existing fabrication processes much easier while still providing the necessary inductance enhancement.
Solution Approach 2:
The patent replaces the mechanical approach of introducing bulk magnetic material with a deposition-based fabrication method. Instead of physically inserting bulk magnetic materials into coil structures, the magnetic layer is deposited conformally or patterned on the substrate surface, which is compatible with standard semiconductor manufacturing processes and eliminates the integration difficulties associated with bulk material handling.
3Reliability
If inductor devices are configured on a magnetic substrate, then inductor characteristics are improved, but coupling with other devices causes parasitic effects
Solution Approach 1:
The patent applies local quality by using a patterned magnetic layer that is confined to specific regions around the inductor coil rather than using a complete magnetic substrate. This localized magnetic field confinement improves inductor characteristics while preventing unwanted coupling with other devices on the substrate, as the magnetic influence is restricted to the immediate vicinity of the coil structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration maintains high inductance, quality factor, and self-resonate frequency at high frequencies, significantly improving the performance of embedded inductor devices by concentrating magnetic flux and reducing parasitic effects.
Implementation Method 1
enhancing inductance and quality factor by concentrating the induced magnetic flux
Implementation Method 2
reducing magnetic hysteresis loss
Data Source
AI summary
Embedded inductor devices and fabrication methods thereof. An embedded inductor device includes a substrate, a conductive coil disposed on the substrate, and a patterned high-permeability (μr>1) magnetic layer on the substrate. The patterned high-permeability (μr>1) magnetic layer physically contacts the conductive coil. The conductive coil and the patterned high-permeability (μr>1) magnetic layer are intersected and substantially perpendicular to each other.