Embedded Inductor Assembly for PCB Footprint Reduction

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Solution Overview

Problem

Inductors occupy a significant portion of the surface area on circuit boards, hindering miniaturization efforts in hybrid integrated circuits.

Innovation Solution

An inductor assembly is designed with a magnetic component embedded in a groove of a circuit board, surrounded by a winding wire that is electrically connected to the board, and optionally enhanced with a magnetic core for improved performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If inductors are used in circuit board design, then signal adjusting and wave filtering functions are achieved, but the occupied surface area increases significantly

Engineering Contradiction:
Improvesignal adjusting and wave filtering functionVSAvoidsurface area occupied by inductor assembly
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent transitions the inductor assembly from a planar surface-mounted configuration to a three-dimensional embedded structure within the circuit board. The groove body is formed by removing material from the circuit board to create a cavity, allowing the magnetic component and winding wire to be positioned within the board thickness rather than occupying surface area. This dimensional transition enables the inductor to maintain its electromagnetic functionality while significantly reducing the footprint on the circuit board surface.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent embeds the magnetic component and winding wire assembly inside the groove body of the circuit board, creating a nested structure where the inductor assembly is contained within the board itself. The groove body acts as a housing that encloses the magnetic component, which in turn contains the winding wire. This nesting approach integrates the inductor function into the board structure, eliminating the need for separate surface-mounted inductor components and reducing overall device footprint.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Volume of moving object

If the number of passive components is reduced through embedded technology, then product size is reduced, but manufacturing complexity increases

Engineering Contradiction:
Improveproduct sizeVSAvoidmanufacturing process complexity
Core Design Contradiction:
Volume of moving objectVSEase of manufacture

Solution Approach 1:

The patent performs preliminary actions during circuit board manufacturing by forming the groove body through material removal before the inductor assembly is finalized. The groove is created during the board fabrication process, and the magnetic component and winding wire are prepared in advance for embedding. This preliminary preparation of the embedding cavity and pre-fabrication of components simplifies the overall manufacturing process by integrating inductor production into the board manufacturing flow rather than requiring separate post-assembly steps.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent merges the inductor assembly manufacturing process with the circuit board manufacturing process. The groove body formation, magnetic component embedding, and winding wire installation are integrated into the board fabrication sequence. This consolidation allows both the board and inductor to be manufactured simultaneously using the same equipment and process infrastructure, reducing overall manufacturing complexity despite the added three-dimensional embedding step.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables miniaturization of inductor assemblies by reducing their footprint on circuit boards while maintaining or enhancing their functional performance.

Implementation Method 1

a winding wire, arranged on the magnetic component, surrounding along a thickness direction of the magnetic component, and electrically connected to the circuit board

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS12568586B2Inductor assembly and manufacturing method for inductor assembly
Publication Date: 2026.03.03 SHENNAN CIRCUITS
  • US12568586B2 patent drawing
  • US12568586B2 patent drawing
  • US12568586B2 patent drawing

AI summary

An inductor assembly and a manufacturing method for an inductor assembly are provided. The inductor assembly includes a circuit board, a magnetic component, and a winding wire. The circuit board defines a groove body, the magnetic component is embedded in the groove body, and the winding wire is arranged on the magnetic component, surrounds along a thickness direction of the magnetic component, and is electrically connected to the circuit board.