Embedded Inductor Module Layout to Limit Shield Film Coupling
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Solution Overview
Problem
In electronic component modules, a short distance between the inductor element and the shield film causes magnetic field coupling, leading to characteristic degradation of the inductor element, while increasing this distance to mitigate this issue results in a larger module size.
Innovation Solution
The inductor element is disposed inside the substrate, allowing for an increased distance between the inductor element and the shield film without expanding the module size, thereby reducing magnetic field coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the inductor element is mounted on the substrate surface, then the module size is reduced, but the distance between the inductor element and the shield film becomes short causing magnetic field coupling and characteristic degradation
Solution Approach 1:
The inductor element is moved from the substrate surface (2D plane) to inside the substrate (3D space), utilizing the thickness dimension to increase the distance between the inductor element and the shield film while maintaining a compact module footprint
2Reliability
If the distance between the inductor element and the shield film is increased to suppress magnetic field coupling, then the inductor element characteristics are improved, but the module size increases
Solution Approach 1:
The inductor element is embedded inside the substrate, nesting it within the existing substrate structure rather than placing it externally. This allows the inductor element to be positioned in the thickness direction, increasing separation from the shield film without expanding the module's planar dimensions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the creation of a small-sized electronic component module that suppresses the deterioration of inductor element characteristics while maintaining a compact form factor.
Implementation Method 1
a distance between the inductor element and the shield film is short, the shield film is coupled to a magnetic field generated by the inductor element
Data Source
AI summary
An electronic component module includes a substrate, an inductor element, a plurality of mounting type electronic components, and a shield film. The substrate has a first main surface and a second main surface, and the second main surface side is a side to be mounted on another circuit board. A first mounting type electronic component and a second mounting type electronic component are mounted on the first main surface. The shield film covers the first mounting type electronic component and the second mounting type electronic component and the first main surface side. The inductor element is disposed inside the substrate.