Embedded Integrated Inductor Substrate for Tolerance Reduction
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Solution Overview
Problem
The traditional integrated inductor manufacturing process faces challenges in miniaturization due to large combined size tolerance from coil placement and magnetic cavity alignment, and difficulties in leading out the coil for conductive connection and alignment with substrate wiring, leading to low yield.
Innovation Solution
A manufacturing method for a substrate embedded with integrated inductor involves forming a magnetic material and conduction copper columns within dielectric layers, synchronously with substrate wiring, reducing combined tolerance and improving alignment accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the traditional process of winding a finished coil and implanting it into a magnetic cavity is used, then the inductor can be manufactured, but the combined size tolerance is large which prevents miniaturization
Solution Approach 1:
The patent merges the coil and magnetic cavity into a single integrated structure formed simultaneously within the substrate. The coil is formed as a conductive pattern layer that is embedded directly into the substrate along with the magnetic material, eliminating the need for separate coil winding and cavity implantation steps. This integration reduces cumulative tolerances and enables miniaturization.
Solution Approach 2:
The coil structure is formed preliminarily as part of the substrate manufacturing process before final assembly. The conductive pattern layer is deposited and patterned on the substrate during the same manufacturing sequence as the magnetic material, ensuring precise alignment and reducing size tolerance accumulation.
2Reliability
If the traditional coil implantation method is used, then the inductor can be assembled, but it is difficult to lead out the coil for conductive connection and alignment with substrate wiring, leading to low yield
Solution Approach 1:
The coil leads are merged with the substrate wiring system by forming the coil as a conductive pattern layer that is continuously connected to external pad structures on the substrate. This integration eliminates alignment issues between separate coil and substrate wiring components, improving both reliability and manufacturing yield.
3Manufacturing precision
If separate manufacturing steps for coil and magnetic cavity are used, then the components can be produced independently, but the process complexity increases and alignment accuracy decreases
Solution Approach 1:
The manufacturing process merges the formation of the coil and magnetic cavity into a single integrated process sequence. The conductive pattern layer for the coil is deposited and patterned on the substrate simultaneously with the magnetic material formation, eliminating multiple separate manufacturing steps and their associated alignment requirements.
Solution Approach 2:
The substrate serves multiple functions: it acts as both the structural base and the integration platform for both the magnetic material and the coil conductive patterns. This multi-functionality reduces the number of separate components and manufacturing processes required.
Data Source
AI summary
A manufacturing method for a substrate embedded with integrated inductor includes: providing a bearing plate; manufacturing a first conduction copper column on the bearing plate; arranging a first dielectric layer on the bearing plate which covers the first conduction copper column; opening the first dielectric layer to form a first opening; filling a magnetic material at the first opening; grinding the first dielectric layer so that surfaces of the first conduction copper column and the magnetic material are flush with a surface of the first dielectric layer; removing the bearing plate, etching a metal layer on the surface of the first dielectric layer to form a package substrate; arranging a first circuit layer and a solder mask layer on an upper surface and a lower surface of the package substrate; and forming a window in the solder mask layer corresponding to the first circuit layer.