Multilayer Embedded Inductors for Compact Low-Ripple Power Routing
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Solution Overview
Problem
Current power management systems face challenges in reducing size while maintaining effective power management, requiring new components and methods to minimize space consumption and address electromagnetic noise and ripple in power output signals.
Innovation Solution
The integration of multilayer electrical routing structures with inductive devices, such as serpentine and solenoid coils, within electronic packages and circuit boards to route and regulate power signals, utilizing conductive vias and shielding structures to minimize electromagnetic interference and reduce ripple.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If power management systems are reduced in size to meet customer needs, then space consumption is reduced, but space for electronic components is commensurately reduced or eliminated
Solution Approach 1:
The patent merges the inductor and capacitor components into a single integrated structure formed by conductive traces on the same substrate layer. The inductor traces and capacitor traces are combined to form a single component that provides both inductance and capacitance functions, eliminating the need for separate discrete components and reducing overall space requirements
Solution Approach 2:
The integrated inductive device serves multiple functions: it provides inductance for power filtering, acts as an electromagnetic shield through its conductive structure, and integrates with the multilayer routing structure to deliver regulated power. This multi-functionality reduces the number of separate components needed in the power management system
2Reliability
If conventional separate components are used for inductors and capacitors, then component functionality is maintained, but space consumption increases
Solution Approach 1:
The patent combines separate inductor and capacitor components into a single integrated structure where conductive traces on the substrate form both inductive and capacitive elements. This merging maintains the necessary electrical functions while significantly reducing the total volume occupied by power management components
3Ease of manufacture
If traditional routing structures are used, then electrical connections are established, but electromagnetic noise and ripple in power output signals increase
Solution Approach 1:
The patent converts the conductive traces, which could potentially radiate electromagnetic noise, into shielding structures. The conductive traces are configured to act as electromagnetic shields that contain and redirect electromagnetic fields, transforming potential harmful radiation into beneficial shielding that reduces noise and ripple in the power output signals
Solution Approach 2:
The multilayer routing structure with integrated inductive devices acts as an intermediary between the power input and output circuits. The conductive traces and vias are configured to filter and condition the power signals, reducing electromagnetic interference and ripple before the signals reach the output
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables compact power management systems with reduced electromagnetic noise and ripple, effectively delivering regulated power output signals while minimizing space and electromagnetic interference.
Implementation Method 1
The multilayer routing structure has one or more electrical conductors on each of at least two layers configured to route the power input signal from the external circuit to the IC and to route the regulated power output signal from the IC to the external circuit
Implementation Method 2
The one or more electrical conductors form an integrated inductive device having a respective portion disposed on each of the at least two layers and wherein the power output signal is coupled to the external circuit through the integrated inductive device
Data Source
AI summary
An electronic package comprises an integrated circuit (IC) configured to receive a power input signal and to deliver a regulated power output signal. A multilayer electrical routing structure is attached to the IC and is configured to couple the electronic package to an external circuit. The multilayer routing structure has one or more electrical conductors on each of at least two layers which are configured to route the power input signal from the external circuit to the IC and to route the regulated power output signal from the IC to the external circuit. The one or more electrical conductors form an integrated inductive device having a respective portion disposed on each of the at least two layers and the power output signal is coupled to the external circuit through the integrated inductive device.