Embedded Interconnect Capacitor Layout for Low-Impedance Chip Packaging
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Solution Overview
Problem
In semiconductor packaging, there is a challenge in designing interconnect structures that connect semiconductor chips while managing impedance and noise, which affects the performance of high-power devices like CPUs and GPUs, and existing decoupling capacitors are not efficiently configured to handle power delivery across multiple frequency ranges.
Innovation Solution
The integration of a decoupling capacitor, referred to as an integrated stack capacitor (ISC), is embedded within the interconnect package's redistribution layer, close to the semiconductor chips, to reduce impedance and noise, and potentially replace die-side and land-side capacitors, thereby enhancing power delivery and reducing the package footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If decoupling capacitors are implemented using die-side capacitors (DSC) or land-side capacitors (LSC) disposed on package substrate surfaces, then power delivery is provided to semiconductor chips, but the package footprint increases and impedance management becomes less effective
Solution Approach 1:
The patent merges the interconnect package structure with the decoupling capacitor into a single integrated component. The capacitor is formed within the interconnect package using alternating conductive layers and dielectric layers, eliminating the need for separate DSC or LSC components on the package substrate. This integration reduces the overall package footprint while maintaining power delivery functionality.
Solution Approach 2:
The patent transitions from planar capacitor configurations (DSC/LSC on substrate surfaces) to a vertical, multi-layered capacitor structure within the interconnect package. The capacitor utilizes stacked conductive layers separated by dielectric layers in the vertical dimension, enabling high capacitance density without increasing the lateral package footprint.
2Object-affected harmful factors
If traditional decoupling capacitors are used on package substrate, then noise reduction is achieved, but impedance management across multiple frequency ranges is insufficient
Solution Approach 1:
The patent implements local quality by positioning the decoupling capacitor in close proximity to the semiconductor chip within the interconnect package. This localized placement creates a low-impedance power delivery path specifically for the chip, effectively managing impedance at the point of consumption and reducing noise more effectively than distant capacitors on the package substrate.
Solution Approach 2:
The patent uses composite material structures with alternating conductive layers (e.g., copper, aluminum) and dielectric layers (e.g., silicon oxide, silicon nitride) to form the capacitor. This composite layered structure provides frequency-dependent impedance characteristics that effectively manage noise across multiple frequency ranges, superior to traditional single-material capacitor designs.
3Reliability
If capacitor is embedded in interconnect package redistribution layer close to semiconductor chips, then impedance is reduced and noise is minimized, but manufacturing complexity increases
Solution Approach 1:
The patent achieves universality by designing the interconnect package to serve multiple functions: signal interconnection, power delivery, and decoupling. The same conductive and dielectric layers that form the interconnect structure also constitute the decoupling capacitor, eliminating the need for separate capacitor manufacturing processes and reducing overall manufacturing complexity despite the enhanced functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides low-impedance power delivery with reduced noise and a smaller footprint, improving the performance of high-power semiconductor devices by minimizing parasitic inductance and allowing for faster power delivery, while also potentially eliminating the need for external decoupling capacitors.
Implementation Method 1
The capacitor may be a decoupling capacitor configured to reduce impedance and noise applied to a load, that is, the semiconductor chips in the semiconductor package
Data Source
AI summary
Provided is a semiconductor package which includes: a die stack including at least two semiconductor chips laterally arranged and isolated from each other by a molding material; and an interconnect package disposed above or below the die stack and connecting the semiconductor chips to each other, wherein the interconnect package having a smaller lateral width than the die stack is entirely overlapped by the die stack in a vertical direction, and a capacitor is disposed inside the interconnect package and connected to at least one of the semiconductor chips and configured to be connected to a voltage source and a ground.