Embedded Interconnect Mutual Inductance Measurement Circuit In Situ

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Solution Overview

Problem

Existing methods for measuring mutual inductance between embedded interconnects require disconnecting signal wires, which is inefficient and time-consuming, and there are no effective in-situ measurement techniques for mutual inductance.

Innovation Solution

A system and method using a coupling generator to induce a current ramp signal on a first communication transmission line, sampling and integrating the induced voltage on a second line with a switched capacitor integrator, and utilizing a comparator to determine mutual inductance by counting cycles until a threshold is crossed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If traditional test equipment is used to measure mutual inductance, then measurement capability is achieved, but measurement efficiency is poor and time consumption is high

Engineering Contradiction:

Improvemeasurement efficiencyVSAvoidtime consumption

Core Design Contradiction:

ProductivityVSLoss of time

Solution Approach 1:

The patent implements self-service by integrating the measurement circuit directly into the embedded platform, allowing the system to measure mutual inductance of its own interconnects without external test equipment. The measurement circuit uses embedded processors and memory devices to generate test signals and capture responses, enabling the system to perform self-diagnosis and characterization.

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The patent introduces an intermediary measurement circuit as a bridge between the embedded interconnects and the measurement function. This circuit includes signal generation units, coupling elements, and response capture mechanisms that mediate the measurement process, eliminating the need for external test equipment while maintaining measurement capability.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of operation

If traditional test equipment is used to measure mutual inductance, then measurement capability is achieved, but system complexity increases due to wire disconnection and reconnection

Engineering Contradiction:

Improveease of measurementVSAvoidsystem complexity

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The patent merges the measurement circuit with the embedded platform's existing interconnect structure. The signal generation, coupling, and response capture functions are integrated into the same physical platform being measured, eliminating the need for separate test equipment and wire disconnection/reconnection operations.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The measurement circuit is designed to be universal and multi-functional, capable of measuring mutual inductance across different interconnect configurations and embedded platforms. The circuit can adapt to various signal types and coupling scenarios, reducing the need for specialized test equipment for different measurement scenarios.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Productivity

If in-situ measurement is implemented, then measurement efficiency is improved, but measurement precision must be maintained in embedded environments

Engineering Contradiction:

Improvemeasurement efficiencyVSAvoidmeasurement resolution

Core Design Contradiction:

ProductivityVSMeasurement precision

Solution Approach 1:

The patent implements feedback mechanisms in the measurement circuit to improve precision. The circuit captures response signals from the interconnects and uses feedback processing to extract accurate mutual inductance values. The embedded processor analyzes the captured signals with compensation algorithms to maintain high measurement precision despite the integrated measurement approach.

Inventive Principle:

Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient, in-situ measurement of mutual inductance with improved resolution and noise floor, suitable for high-speed, high-density interconnects, and minimally disruptive to existing systems.

Implementation Method 1

measuring mutual inductance between embedded interconnects

Methodology Applied

Scientific EffectMutual inductance: Electromagnetic Induction

Implementation Method 2

a sample and hold circuit (212) which captures an induced voltage on the second communication transmission line (308) using a switched capacitor storage element

Methodology Applied

Scientific EffectCapacitance: Capacitance

Implementation Method 3

a switched capacitor integrator configured to integrate the induced voltage onto an output voltage node

Methodology Applied

Scientific EffectElectrical integration:

Data Source

PatentUS12625173B2Methods and apparatus for in-situ measurement of mutual inductance between embedded interconnects

Publication Date: 2026.05.12 THE BOEING CO

AI summary

A system and method for measuring mutual inductance between adjacent first communication transmission line and second communication transmission line is disclosed. The system includes a mutual inductance measurement circuit that includes a coupling generator which biases the first communication transmission line with a current ramp signal; a sample and hold circuit which captures an induced voltage on the second communication transmission line using a switched capacitor storage element; a switched capacitor integrator configured to integrate the induced voltage onto an output voltage node; and a comparator configured to switch states once the switched capacitor integration has surpassed a reference trippoint.