Embedded Interposer Grating Couplers for High-Speed Photonic Links
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Solution Overview
Problem
Existing grating couplers in optical signaling systems have inefficiencies that limit high-speed data transmission in integrated circuits, necessitating improvements in coupling efficiency to enhance performance.
Innovation Solution
Integration of grating couplers within an interposer structure, comprising oxide layers and grating couplers, to optically couple photonic dies, enhancing coupling efficiency and data transmission rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional grating couplers are used in optical signaling systems, then device simplicity is maintained, but coupling efficiency is insufficient and data transmission rates are limited
Solution Approach 1:
The grating coupler is embedded within the interposer structure, nesting the optical coupling function inside the existing package substrate. This integration allows the grating coupler to be part of the interposer's layered structure (oxide layers, grating regions) without requiring separate external components, thereby improving data transmission rates while controlling overall device complexity through consolidation
Solution Approach 2:
The patent combines the grating coupler functionality with the interposer structure by integrating the grating regions into the oxide layers of the interposer. This merging of optical coupling elements with the package substrate enables enhanced coupling efficiency and higher data transmission rates without proportionally increasing device complexity, as the grating coupler becomes an integral part of the interposer rather than a separate component
2Productivity
If grating coupler efficiency is improved through integration, then data transmission performance increases, but back reflection losses occur
Solution Approach 1:
The interposer structure incorporates specific oxide layers and grating regions with locally optimized properties to enhance coupling efficiency at the optical interface. By creating localized regions with appropriate refractive indices and grating geometries, the structure improves coupling performance while managing back reflection losses through targeted material placement and structural design
3Ease of manufacture
If existing grating coupler designs are used, then manufacturing simplicity is maintained, but coupling efficiency limits high-speed data transmission
Solution Approach 1:
The grating coupler is divided into discrete grating regions formed within the interposer's oxide layers. This segmentation allows the structure to be manufactured using standard semiconductor fabrication processes (deposition, etching, patterning) that can create multiple layers and regions, maintaining ease of manufacture through modular fabrication steps while achieving improved coupling efficiency through the multi-layer grating structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration of grating couplers in the interposer structure improves data transmission rates and reduces back reflection losses, leading to better device performance and suitability for high-speed applications.
Implementation Method 1
The interposer structure includes a grating coupler having at least one grating region, and the photonic dies mounted on the interposer are optically coupled through the grating coupler of the interposer structure
Data Source
AI summary
A package structure comprises photonic dies and an interposer structure. Each photonic die includes a dielectric layer and a first grating coupler embedded in the dielectric layer. The interposer structure is disposed below the photonic dies. The interposer structure includes an oxide layer and a second grating coupler embedded in the oxide layer. The photonic dies are optically coupled through the first grating couplers of the photonic dies and the second grating coupler of the interposer structure.