Embedded Interposer Grooves Metal Posts Thermal Warpage
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Solution Overview
Problem
Existing interposers with cavity parts for accommodating capacitor components face issues with strength and reliability due to potential peeling of conductor circuits from the insulating layer during heat cycles and warping, which can lead to cracks and reduced thickness.
Innovation Solution
An interposer design featuring an insulating layer with grooves for conductor circuits and metal posts extending from these grooves to the opposite surface, where the conductor circuits are embedded within the insulating layer, and metal posts have exposed bottom surfaces forming electrodes, reducing the need for external terminals and enhancing structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductor circuits are formed on the surface of the insulating layer, then electrical connectivity is achieved, but the conductor circuits may peel off from the insulating layer during heat cycles and warping
Solution Approach 1:
The conductor circuits are merged with the insulating layer by embedding them within grooves formed in the insulating layer. This integration ensures that the conductor circuits and insulating layer move together as a unified structure during heat cycles and warping, eliminating relative motion that would cause peeling and maintaining reliable electrical connections.
Solution Approach 2:
The conductor circuits are transitioned from a surface-mounted configuration to an embedded configuration within the insulating layer. This dimensional change from surface to subsurface placement provides mechanical interlocking and protects the conductor circuits from peeling forces while maintaining electrical connectivity.
2Length of moving object
If the insulating layer thickness is reduced for thinner design, then device thickness is decreased, but strength and reliability are compromised
Solution Approach 1:
The insulating layer is formulated as a composite material containing inorganic filler particles dispersed in a resin matrix. This composite structure provides enhanced mechanical strength and thermal stability, allowing the insulating layer to be made thinner while maintaining sufficient structural strength and reliability under thermal stress.
Solution Approach 2:
The insulating layer exhibits non-uniform properties through the strategic distribution of inorganic filler, creating regions of varying density and strength. This local quality optimization allows for thinning in non-critical areas while maintaining strength in load-bearing regions, achieving an overall thinner design without compromising structural integrity.
3Reliability
If external terminals are used for electrical connection, then connectivity is achieved, but the interposer requires greater thickness
Solution Approach 1:
The external terminals are extracted and replaced by metal posts that extend vertically through the insulating layer to expose electrode surfaces on the outer surface. This eliminates the need for separate external terminals and wire bonds, achieving electrical connectivity while reducing the overall interposer thickness.
Solution Approach 2:
The metal posts serve multiple functions: they provide electrical connectivity between conductor circuits and external components, act as structural support elements, and enable direct bonding surfaces on the interposer outer surface. This multi-functionality consolidates what would otherwise require separate components, reducing thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The embedded conductor circuits and exposed metal post electrodes improve the interposer's strength, reduce warpage, and enhance insulation reliability, allowing for a thinner design while maintaining stability and reliability even under thermal stress.
Implementation Method 1
filling the openings with a plating material such that metal posts including the plating material are formed in the openings of the plating resist respectively
Implementation Method 2
polishing the insulating layer in which the metal posts and the conductor circuits are embedded such that a bottom surface of each of the metal posts is formed to be exposed from a second surface of the insulating layer
Data Source
AI summary
An interposer includes an insulating layer, conductor circuits formed in grooves formed on a first surface of the insulating layer respectively, and metal posts formed in openings extending from the grooves to a second surface of the insulating layer on the opposite side with respect to the first surface such that the metal posts are connected to the conductor circuits respectively. The insulating layer has an opening portion which accommodates an electronic component and is extending from the first surface to the second surface of the insulating layer, and each of the metal posts has an upper surface and a bottom surface on the opposite side of the upper surface such that the upper surface is connected to a respective one of the conductor circuits and that the bottom surface is exposed from the second surface of the insulating layer.