Embedded Interposer Package Structure for Warpage-Resistant IC Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing IC package technologies face challenges in achieving smaller area form factors due to susceptibility to warping, limiting the number of IC dice that can be integrated and increasing package size.
Innovation Solution
Incorporating an interposer layer made of a stiffening material, such as glass or metal, which extends over the entire package substrate to reduce warping susceptibility, combined with conductive through vias and redistribution layers for electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the area form factor of a package is increased to integrate more IC dice, then the integration efficiency is improved, but the package becomes more susceptible to warping
Solution Approach 1:
An interposer layer is introduced as an intermediary component between the IC dice and the package substrate. This interposer layer, made of stiffening material such as glass or metal, serves as a mediator that provides mechanical support and reduces warping susceptibility while enabling the integration of multiple IC dice in a compact arrangement. The interposer layer acts as a structural bridge that decouples the warping issue from the area form factor increase.
Solution Approach 2:
The package structure employs composite materials by combining the interposer layer made of stiffening material (glass or metal) with the package substrate and mold layer. This composite construction integrates materials with different mechanical properties to achieve both the desired electrical connectivity and mechanical stability, allowing the package to maintain rigidity while accommodating multiple IC dice.
2Area of stationary object
If the area form factor of a package is reduced to make it more compact, then the package size is decreased, but the number of IC dice that can be integrated is limited
Solution Approach 1:
The patent utilizes the Z-dimension (vertical stacking) to overcome the area form factor limitation. By stacking IC dice vertically on the package substrate and using through-substrate vias for interconnection, the design transitions from a two-dimensional layout to a three-dimensional structure. This allows multiple IC dice to be integrated in a compact area by utilizing the vertical dimension for additional integration capacity.
3Stability of the object's composition
If package stiffeners are added to reduce warping susceptibility, then the structural stability is improved, but the device complexity increases
Solution Approach 1:
The interposer layer serves multiple functions simultaneously: it provides mechanical stiffening to reduce warping susceptibility, enables electrical interconnection through conductive vias, and facilitates the integration of multiple IC dice. This multi-functional design eliminates the need for separate stiffener components, thereby reducing device complexity while achieving the desired structural stability.
4Stability of the object's composition
If the thickness of a package is increased to reduce warping, then the structural stability is improved, but the area form factor must also increase
Solution Approach 1:
The interposer layer is strategically positioned only in the regions where IC dice are mounted, providing localized stiffening where it is most needed. This local quality approach allows the package to achieve adequate warping resistance without uniformly increasing the overall package thickness across the entire area, thereby maintaining a compact area form factor while improving structural stability at critical locations.
Data Source
AI summary
An electronic device comprises multiple integrated circuit (IC) dice disposed on a package substrate having a substrate area, a mold layer that includes the IC dice, and multiple conductive pillars extending from a surface of at least one IC die to a first surface of the mold layer, and an interposer layer extending over the substrate area and comprised of a stiffening material more rigid than a material of the package substrate. The interposer layer includes multiple electrically conductive through layer vias contacting the conductive pillars at a first surface of the mold layer and extending through the stiffening material to a second surface of the interposer layer.