Embedded Interposer Component Carrier for Dense PCB Routing
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Solution Overview
Problem
The increasing miniaturization and complexity of electronic components on component carriers, such as printed circuit boards, pose challenges in efficiently forming electric connections while maintaining mechanical robustness and heat dissipation, especially as components with closely spaced contacts require effective thermal management and high-density integration.
Innovation Solution
A component carrier is designed with a stack comprising electrically conductive and insulating layers, embedding interposers with vertically extending connections for high-density interconnects and additional lateral conductive structures for efficient connection distribution, allowing for high integration density where needed while maintaining manufacturability and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If interposers with vertically extending connections are embedded in the stack to achieve high-density interconnects, then integration density is improved, but device complexity increases
Solution Approach 1:
The component carrier is divided into distinct functional regions: an interposer region with vertically extending high-density conductive connections for high-speed signals, and lateral conductive structure regions for power and ground distribution. This segmentation allows each region to be optimized independently, achieving high integration density where needed while maintaining manufacturability through standardized processes.
Solution Approach 2:
Different conductive structures are implemented in different locations: vertically extending interposer connections with high integration density are used specifically for signal paths requiring high-speed performance, while lateral conductive structures are used for power and ground distribution. This local differentiation optimizes performance for each function without unnecessarily complicating the entire device.
2Adaptability or versatility
If components with closely spaced contacts are used to increase functionality, then product functionality is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional thermal management by embedding the interposer vertically within the stack and implementing thermal vias that extend through multiple layers. This vertical dimension provides additional thermal pathways, allowing heat to be conducted away from densely packed components more effectively without increasing the footprint.
Solution Approach 2:
The stack employs composite layer structures combining different materials with complementary thermal properties. High-thermal-conductivity materials are strategically placed in thermal via regions and heat dissipation paths, while dielectric materials provide electrical insulation. This composite approach enables effective heat management in high-density configurations.
3Adaptability or versatility
If high-density interconnects are implemented to support complex electronic applications, then product functionality is improved, but manufacturing effort increases
Solution Approach 1:
The interposer is prepared in advance with pre-formed vertically extending conductive connections before being embedded in the stack. This preliminary preparation allows the complex high-density interconnect structure to be manufactured using optimized specialized processes, then integrated into the broader component carrier using standard embedding techniques, thereby reducing overall manufacturing complexity.
Solution Approach 2:
The interposer serves as an intermediary component that bridges high-density signal connections and the broader component carrier architecture. By isolating the complex high-density interconnect functionality within a separate interposer module, the patent enables standardized manufacturing of the interposer itself, which can then be integrated using routine embedding processes, reducing the manufacturing burden on the overall system.
Data Source
AI summary
A component carrier and a method of manufacturing a component carrier are disclosed. The component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, an interposer embedded in the stack and having a plurality of vertically extending electrically conductive through connections, and electrically conductive structures in the stack laterally on both sides of the interposer.