Core-Embedded IPD Shielding for Dense Chip Package Vias
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Solution Overview
Problem
Conventional chip packaging schemes face limitations in via density due to the need to maintain distance between vias coupled to inductors to avoid noise and parasitic effects, which restricts the routing density and performance of electronic devices.
Innovation Solution
Embedding integrated passive devices, such as capacitors, in the core of the substrate to shield vias coupled to inductors, reducing the required keep-out space and allowing closer proximity of vias, thereby increasing substrate via density and improving device performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If vias are placed closer together to increase via density, then substrate via density improves, but noise and parasitic effects increase due to proximity to inductor-coupled vias
Solution Approach 1:
An integrated passive device (IPD), typically a capacitor, is embedded in the substrate core between inductor-coupled vias and other vias. This IPD acts as an intermediary shielding element that blocks electromagnetic noise and parasitic effects from propagating between the vias, allowing them to be placed closer together while maintaining signal integrity.
Solution Approach 2:
The IPD is embedded within the substrate core structure, nesting the shielding function inside the existing substrate architecture. This allows the shield to be integrated without adding external bulk, enabling closer via placement while maintaining compact form factor.
2Area of stationary object
If keep-out space around inductor-coupled vias is reduced, then routing density improves, but signal integrity degrades due to increased noise coupling
Solution Approach 1:
The IPD serves as a shielding intermediary positioned between inductor-coupled vias and adjacent signal paths. This allows routing to be placed closer to inductors while the IPD blocks harmful electromagnetic coupling, maintaining signal integrity despite reduced spacing.
3Reliability
If distance between vias is increased to reduce noise, then signal integrity improves, but via density decreases limiting routing capability
Solution Approach 1:
By inserting an IPD as a shielding intermediary between vias, the patent enables closer via placement while maintaining signal integrity. The IPD blocks noise propagation, effectively replacing the need for large physical spacing with an active shielding mechanism.
Solution Approach 2:
Instead of solving the noise problem by increasing horizontal spacing between vias, the patent introduces shielding in the vertical dimension by embedding IPDs within the substrate core. This multi-dimensional approach allows dense via placement while maintaining signal integrity through vertical shielding layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The embedded passive devices effectively shield noise between adjacent conductors, enabling higher via density, enhancing signal integrity, and improving power routing while maintaining high performance without degrading signal quality.
Implementation Method 1
integrated passive devices embedded in a core of a substrate of the chip package, such as a package substrate or an interposer, that shield routings coupled to inductors from adjacent through-substrate conductive paths
Data Source
AI summary
Chip packages are described herein that includes integrated passive devices embedded in a core of a substrate of the chip package, such as a package substrate or an interposer, that shield routings coupled to inductors from adjacent through-substrate conductive paths (e.g., vias). In one example, a chip package includes an integrated circuit (IC) die mounted to a substrate. A core of the substrate has a plurality of inductor routing vias, a plurality of signal transmission vias, and a plurality of ground and power routing vias. A first integrated passive device (IPD) is disposed in the core and separates at least one of the plurality of inductor routing vias from an adjacent via, the adjacent via being one of the plurality of signal transmission vias or one of the plurality of ground and power routing vias.