3D Substrate-Embedded IPD Structure for PCB Space Constraints
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Solution Overview
Problem
The increasing miniaturization of semiconductor devices and packaging structures has led to a reduction in surface area available for mounting electrical components like capacitors and other integrated passive devices (IPDs) on printed circuit boards (PCBs), making component mounting increasingly difficult.
Innovation Solution
The integration of substrate-embedded integrated passive devices (IPDs), such as deep trench capacitors (DTCs), within the dielectric layers of semiconductor dies, allowing for the relocation of electrical components from surface areas to internal areas, thereby freeing up surface space for other components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If successive reductions in minimum feature size are implemented to increase integration density, then more components can be integrated into a given area, but the surface area available for mounting electrical components decreases
Solution Approach 1:
The patent transitions from two-dimensional surface mounting to three-dimensional embedding by forming capacitors within the substrate thickness direction. Trenches are etched into the substrate and filled with capacitor structures, utilizing the vertical dimension to create IPDs that do not occupy additional surface area, thereby resolving the contradiction between integration density and available mounting surface.
2Productivity
If three-dimensional device structures with stacked chips are implemented, then integration density and bandwidth are improved, but the surface area occupied by packaging structures increases
Solution Approach 1:
The patent merges the capacitor structures with the substrate itself by forming trenches directly in the substrate and filling them with capacitor dielectric and electrodes. This integration eliminates the need for separate surface-mounted capacitor components and their associated packaging structures, thereby maintaining high integration density while reducing the surface area occupied by packaging.
3Reliability
If electrical components are mounted on the surface of PCBs, then component functionality is achieved, but space utilization efficiency decreases due to reduced surface area
Solution Approach 1:
The patent extracts capacitors from the surface mounting domain and relocates them into the substrate interior. By forming trenches within the substrate and filling them with capacitor structures, the design removes the need for surface-mounted capacitors, thereby freeing up surface area while maintaining all necessary electrical component functionalities.
Data Source
AI summary
A three-dimensional device structure includes a die including a semiconductor substrate, an interconnect structure disposed on the semiconductor substrate, a through silicon via (TSV) structure that extends through the semiconductor substrate and electrically contacts a metal feature of the interconnect structure, and an integrated passive device (IPD) embedded in the semiconductor substrate and electrically connected to the TSV structure.