Embedded Jumper Conductor for Single-Layer PCB Crossings

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Solution Overview

Problem

Existing methods for crossing conductor lines in single-layer printed circuit boards (PCBs) are inefficient, often requiring additional layers or protrusions, which increase thickness and manufacturing complexity, and result in suboptimal contact quality.

Innovation Solution

The integration of an embedded pre-fabricated jumper element within the PCB allows for conductor line crossings without additional layers, using materials like FR4 laminate with Cu traces, ensuring reliable, solder-less connections and maintaining a flat module surface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If jumpers are attached on top of the PCB to accommodate conductor line crossing, then conductor crossing is enabled, but the module is no longer flat and surface deformation occurs

Engineering Contradiction:

Improveconductor line crossing capabilityVSAvoidflatness of module surface

Core Design Contradiction:

Adaptability or versatilityVSShape

Solution Approach 1:

The jumper element is embedded within a cavity in the PCB substrate, nesting the jumper inside the board structure rather than attaching it on the surface. This allows conductor crossing functionality while maintaining a flat external surface, as the jumper is contained within the substrate volume.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The solution moves the jumper from a surface-mounted configuration (2D plane) to an embedded configuration utilizing the third dimension (depth/volume) of the PCB substrate. The jumper is placed in a cavity below the surface, enabling crossing functionality without surface protrusion.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If jumpers are soldered or chemically adhered to the substrate, then electrical connection is established, but contact quality is suboptimal

Engineering Contradiction:

Improveelectrical contact qualityVSAvoidconnection process complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The jumper element and substrate are manufactured as an integrated unit using the same PCB manufacturing processes (lamination, copper deposition, etching). This merging of components eliminates the need for separate attachment steps like soldering or chemical adhesion, providing both optimal electrical contact and manufacturing simplicity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The jumper element is self-contained with its own conductive traces and contact pads that are directly formed during PCB manufacturing. The jumper serves its own electrical connection function without requiring external soldering or adhesive bonding processes.

Inventive Principle:

Principle #25Self-service

3Adaptability or versatility

If multiple layers are used for conductor crossing, then crossing capability is achieved, but the module becomes thicker and requires more manufacturing steps

Engineering Contradiction:

Improveconductor crossing capabilityVSAvoidnumber of manufacturing steps

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Instead of using multiple PCB layers for crossing, the solution segments the crossing function into a separate embedded jumper element within a single layer. This allows the main PCB to remain single-layer while the jumper provides the crossing functionality independently.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The conductor crossing function is extracted from the main PCB layer structure and placed into a separate embedded jumper element. This extraction allows the main PCB to maintain its simple single-layer structure while the jumper handles the crossing requirement.

Inventive Principle:

Principle #2Taking out (Extraction)

4Reliability

If additional build-up layers are manufactured for jumper integration, then embedded jumper is achieved, then conductor crossing is enabled, but manufacturing complexity and cost increase

Engineering Contradiction:

Improveconnection qualityVSAvoidmanufacturing process simplicity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The embedded jumper element is manufactured using the same universal PCB manufacturing processes (lamination, copper deposition, etching, drilling) used for the main PCB. This multi-functionality allows the jumper to be produced alongside the substrate without requiring specialized additional manufacturing steps.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS10231335B2Electronic module with embedded jumper conductor

Publication Date: 2019.03.12 IMBERATEK LLC

AI summary

The present invention generally provides a novel method for manufacturing an electronic module with crossed conducting lines and a novel electronic module with crossed conducting lines. In particular, an aspect of the present invention is to provide a thin, single layer electronic module. It is also an object of the present invention to provide an electronic module with an embedded jumper element having reliable high quality connections and contacts. To achieve at least some of the aspects of the present invention, an embedded pre-fabricated jumper module is placed inside a printed circuit board which allows the crossing of conducting lines within the module without manufacturing additional layers over the whole PCB board. The resultant PCB will have improved contacts and will not have surface deformation.