Photonic Engine Assembly With Embedded Laser Die and Optical Interposer
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Solution Overview
Problem
Existing technologies face challenges in integrating optical and electrical signaling components efficiently, particularly in forming compact devices that can convert between optical and electrical signals while maintaining structural integrity and functionality.
Innovation Solution
The development of a compact universal photonic engine (COUPE) that embeds laser dies within a semiconductor device and bonds it to an optical interposer, utilizing a silicon-on-insulator substrate with integrated optical components and metallization layers for efficient signal conversion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If optical and electrical components are integrated into a single device, then device functionality and compactness are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges optical components (laser die, optical waveguides) and electrical components (semiconductor device with metallization layers) into a single integrated device structure. The laser die is coupled to the semiconductor device such that optical signals can be generated and transmitted through the same device that performs electrical processing, eliminating the need for separate optical and electrical devices and their interconnections.
Solution Approach 2:
The integrated device performs multiple functions within a single structure: the laser die generates optical signals, the optical waveguides transmit these signals, and the semiconductor device with its metallization layers performs electrical signal processing. This multi-functional integration allows the device to handle both optical and electrical signaling within one compact unit.
2Volume of moving object
If optical and electrical components are integrated into a single device, then compactness is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the integrated device into distinct functional modules: a laser die for optical signal generation, optical waveguides for signal transmission, and a semiconductor device with metallization layers for electrical processing. Each module can be manufactured and characterized separately using established processes, then assembled with controlled precision requirements that are more manageable than attempting to manufacture the entire integrated structure as a single unit.
3Productivity
If laser dies are embedded within semiconductor devices, then signal conversion efficiency is improved, but structural integrity challenges increase
Solution Approach 1:
The patent applies local quality by providing targeted structural support and coupling mechanisms specifically at the interface between the laser die and semiconductor device. The coupling structure is designed with appropriate mechanical properties to accommodate the different materials and maintain structural integrity at this critical interface, while allowing efficient optical and electrical signal transmission. The metallization layers are configured to provide both electrical connectivity and mechanical support.
Data Source
AI summary
Optical devices and methods of manufacture are presented in which an opening is formed within a first semiconductor device and then bonded to other optical devices. A laser die or other fill material may be used to refill the opening. The first semiconductor device is then electrically connected to an optical interposer.