Encapsulant-Embedded Leadframe Terminals for Compact Circuit Modules
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for forming top-side interconnects in circuit modules are costly and require significant manufacturing space, making them inefficient for package-on-package systems.
Innovation Solution
The development of circuit modules with encapsulant-embedded leadframe terminals, where leadframe interconnects are formed from a planar leadframe and embedded in encapsulant material, allowing for cost-effective manufacturing and reduced space usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional methods are used to form top-side interconnects, then electrical connectivity is achieved, but manufacturing cost increases and manufacturing space requirements increase
Solution Approach 1:
The patent merges the leadframe structure with the encapsulant material by embedding the leadframe terminals directly into the encapsulant during the encapsulation process. This integration eliminates the need for separate top-side interconnect formation steps, reducing manufacturing complexity and cost while maintaining electrical connectivity functionality.
Solution Approach 2:
The encapsulant material serves multiple functions: it provides structural encapsulation for the circuit module and simultaneously acts as the medium for forming top-side interconnects through embedded leadframe terminals. This multi-functionality eliminates the need for dedicated interconnect formation equipment and processes, reducing manufacturing space and cost requirements.
2Ease of manufacture
If conventional equipment is used to form top-side interconnects, then electrical connectivity is achieved, but manufacturing floor space increases
Solution Approach 1:
The patent combines the encapsulation process with the interconnect formation process into a single integrated step. By embedding leadframe terminals during encapsulation, the process eliminates the need for separate conventional interconnect formation equipment, significantly reducing manufacturing floor space requirements while maintaining technical functionality.
3Ease of manufacture
If leadframe terminals are embedded in encapsulant, then manufacturing cost decreases and manufacturing space decreases, but manufacturing precision requirements increase
Solution Approach 1:
The patent performs preliminary positioning of leadframe terminals before encapsulation, where terminals are pre-aligned with designated locations on the circuit module substrate. This preliminary action ensures that when terminals are embedded during encapsulation, they achieve the required precision without needing complex post-processing adjustments, thus balancing cost reduction with manufacturing precision requirements.
Data Source
AI summary
A circuit module includes a module substrate with a mounting surface, and a plurality of conductive features and electronic circuitry coupled to the mounting surface. Encapsulant material covers the electronic circuitry and the mounting surface, and an upper surface of the encapsulant material defined a first surface of the circuit module. A plurality of leadframe terminals, each separated from a non-planar leadframe unit, extend from the conductive features at the mounting surface through the encapsulant material toward the first surface of the circuit module. Each of the leadframe terminals is formed from an elongated planar conductive feature of a leadframe unit, and the plurality of leadframe terminals is electrically coupled to the electronic circuitry through the conductive features and the module substrate. Encapsulant divots may extend into the encapsulant material from the first surface of the circuit module, and proximal ends of the leadframe terminals terminate at the encapsulant divots.