Embedded LED Substrate Thermal Dissipation

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Solution Overview

Problem

The high cost and complexity of thermal management in LED devices, particularly with surface mount technology, where high-performance materials are required for heat dissipation, leading to increased manufacturing costs.

Innovation Solution

An LED device design where the LED substrate is embedded within a circuit board substrate, allowing for efficient heat dissipation through a thermally conductive substrate, enabling the use of inexpensive circuit board materials and simplifying the manufacturing process by integrating the LED module with conductive tracks for easy electrical connection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If surface mount technology is used to mount LED directly onto PCB, then component density and compact design are improved, but thermal management cost increases due to requirement of high-performance thermal conductive materials

Engineering Contradiction:

Improvecomponent densityVSAvoidthermal management cost

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The invention extracts the thermal management function from the PCB by introducing a separate heat sink component. The heat sink is mounted onto the PCB surface and provides the thermal conduction path, allowing the PCB to use inexpensive standard materials while still achieving effective heat dissipation from the LED.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The heat sink acts as an intermediary component between the LED and the PCB. It mediates the thermal transfer by providing a dedicated thermal conduction path from the LED to the ambient environment, while the PCB serves only its electrical and mechanical support functions with standard materials.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If heat sink is provided between LED and PCB mounting surface, then thermal management performance is improved, but device complexity increases due to additional components and assembly steps

Engineering Contradiction:

Improvethermal management performanceVSAvoidassembly complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The invention merges the heat sink mounting with the existing PCB assembly process. The heat sink is attached to the PCB surface using standard PCB mounting techniques (screws, clips, or adhesive), integrating it into the existing assembly workflow rather than requiring separate complex thermal management assembly steps.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design achieves cost-effective and high thermal performance in a compact form factor, allowing for efficient heat dissipation without the need for expensive heat management materials in the circuit board, while maintaining a simple and efficient assembly process.

Implementation Method 1

The LED substrate is of a material that provides good heat dissipation, so that heat generated by the LED chip is dissipated by the LED substrate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10985303B2Method of making an LED device

Publication Date: 2021.04.20 LUMILEDS SINGAPORE PTE LTD

AI summary

A thermally efficient, cost efficient and compact LED device having an LED module and a circuit board. The LED module having an LED substrate and an LED chip mounted on a mounting surface of the LED substrate. The circuit board is composed of a circuit board substrate and has a plurality of conductive tracks on a surface of the circuit board substrate. The LED substrate is embedded in the circuit board substrate.