Embedded LED Waveguide Illumination for Thermal and Optical Management
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Solution Overview
Problem
Current LED-based backlight devices are limited by size, price, and performance due to their transparent encapsulation, phosphor or fluorescent semiconductor material, and lead frame, which increase size and cost while compromising light efficiency and heat evacuation.
Innovation Solution
An illumination apparatus with embedded light-emitting sources, such as bare LED dies, within a waveguide material that propagates and diffuses light, utilizing photoluminescent materials to convert light wavelengths and enhance light quality, brightness, and color profiles, suitable for various applications including passive displays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional LED components (transparent encapsulation, phosphor material, lead frame) are used, then the LED structure is complete and functional, but the size increases and cost increases while light efficiency decreases
Solution Approach 1:
The patent extracts and eliminates unnecessary traditional LED components including the transparent encapsulation, phosphor material, and lead frame. By removing these components, the LED size is reduced while maintaining functionality through alternative designs such as direct bonding of the semiconductor chip to the circuit board and use of wavelength conversion layers integrated directly on the chip surface.
Solution Approach 2:
The patent applies local quality by placing wavelength conversion materials only in specific locations where needed for color conversion, rather than using universal phosphor coatings. This allows precise control over light emission characteristics while minimizing material usage and overall device size.
2Reliability
If traditional LED components (transparent encapsulation, phosphor material, lead frame) are used, then the LED structure is complete and functional, but the cost increases
Solution Approach 1:
The patent removes expensive traditional components such as the lead frame and transparent encapsulation, replacing them with more cost-effective alternatives like direct chip bonding and integrated wavelength conversion layers, thereby reducing manufacturing costs while maintaining LED functionality.
Solution Approach 2:
The patent merges multiple functions into fewer components. For example, the wavelength conversion layer is integrated directly on the semiconductor chip surface, combining the chip mounting and wavelength conversion functions into a single integrated structure, reducing the number of parts and assembly steps.
3Reliability
If traditional LED components (transparent encapsulation, phosphor material, lead frame) are used, then the LED structure is complete, but light efficiency decreases
Solution Approach 1:
The patent extracts and removes components that cause energy loss, particularly the phosphor material which absorbs significant light energy and converts it to heat. By eliminating phosphor and using direct wavelength conversion approaches, the patent reduces energy loss and improves light extraction efficiency.
Solution Approach 2:
The patent applies wavelength conversion materials locally with precise optical properties tailored to specific wavelength ranges, optimizing the conversion efficiency and minimizing energy loss. This localized approach allows for better spectral matching and reduced thermal losses compared to broad-spectrum phosphor materials.
4Reliability
If traditional LED components (transparent encapsulation, phosphor material, lead frame) are used, then the LED structure is complete, but heat evacuation is compromised
Solution Approach 1:
The patent removes the lead frame, which is a traditional heat dissipation component, and replaces it with direct thermal conduction paths through the semiconductor chip mounting structure. This eliminates thermal interfaces and improves heat evacuation efficiency by providing direct thermal coupling between the chip and heat sink.
Solution Approach 2:
The patent merges the electrical connection and thermal management functions into a single integrated mounting structure. The semiconductor chip is directly bonded to the circuit board with thermal conductive materials, combining electrical interconnection and heat dissipation pathways into one unified structure, improving overall thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides superior optical and geometrical properties with high light quality, brightness, and color profiles, reducing size and cost while improving efficiency and heat management, making it suitable for diverse applications like passive displays and LCD devices.
Implementation Method 1
a photoluminescent material for converting some of the source light to a different wavelength. The converted source light mixes with unconverted source light to form output light spectrally different from both the converted source light and the unconverted source light
Data Source
AI summary
In one aspect, an illumination apparatus includes a waveguide, embedded in which are a light-emitting source and a photoluminescent material. Output light is emitted from at least a portion of a first surface of the waveguide.