Embedded Liquid Cooling With Direct-Bonded Cold Plate Channels
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Solution Overview
Problem
Current cooling systems for microelectronic devices face inefficiencies due to high thermal resistance at the interface between chips and heat dissipation devices, which hampers heat transfer and increases energy consumption, particularly in high-power density applications.
Innovation Solution
An integrated cooling assembly is embedded within device packages, featuring a cold plate directly bonded to the semiconductor device without thermal interface materials, with a patterned design that includes sloping sidewalls and support features to create a coolant channel, reducing thermal resistance and enhancing heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal interface materials are used to couple the chip and heat dissipation device, then thermal contact is maintained, but thermal resistance increases and cooling efficiency decreases
Solution Approach 1:
The patent removes the thermal interface material layer from the system by directly bonding the cold plate to the semiconductor device. This extraction of the intermediate layer eliminates the additional thermal resistance that TIMs introduce, while direct bonding maintains reliable thermal contact through intimate surface contact and mechanical bonding.
Solution Approach 2:
The patent merges the cold plate bonding interface directly with the semiconductor device surface, eliminating the separate TIM layer. By combining the bonding function and thermal conduction function into a single direct interface, the system reduces thermal resistance while maintaining reliable thermal contact.
2Reliability
If conventional cooling systems with thermal interface materials are used, then thermal contact is achieved, but the thermal resistance path remains long and energy consumption increases
Solution Approach 1:
The patent extracts and removes the thermal interface material from the thermal path, creating a direct bonding interface between the cold plate and semiconductor device. This shortens the thermal resistance path and reduces the energy required for heat dissipation.
Solution Approach 2:
The patent changes the thermal resistance parameter by eliminating the TIM layer and using direct bonding. This parameter change reduces the overall thermal resistance of the interface, thereby reducing energy consumption for cooling while maintaining reliable thermal contact.
3Power
If high-power density chips are used to improve performance, then computing power increases, but thermal flux increases and chip temperature rises
Solution Approach 1:
The patent replaces the conventional mechanical assembly with TIM layers with a direct bonding system. This substitution creates a lower thermal resistance interface that can handle the high thermal flux from high-power density chips, effectively managing the temperature rise while maintaining high computing power.
4Reliability
If thermal interface materials are used to facilitate heat transfer, then thermal contact is maintained, but interfacial boundary resistance inhibits heat transfer
Solution Approach 1:
The patent extracts and eliminates the thermal interface material from the system, creating a direct bonding interface. This removal eliminates the interfacial boundary resistance that TIMs introduce, while direct bonding maintains reliable thermal contact through direct surface-to-surface contact.
Solution Approach 2:
The patent merges the thermal contact function and heat transfer function into a single direct bonding interface, eliminating the separate TIM layer that creates interfacial boundary resistance. This merging improves heat transfer efficiency while maintaining reliable thermal contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly improves thermal efficiency by shortening the thermal resistance path and enhancing heat transfer between the semiconductor device and coolant fluids, thereby reducing energy consumption and increasing the reliability of microelectronic devices.
Implementation Method 1
The cold plate includes a patterned first side having a base surface, sidewalls, and a plurality of support features. The base surface is spaced apart from the semiconductor device to collectively define a coolant channel therebetween.
Implementation Method 2
enhancing heat transfer between the semiconductor device and coolant fluids
Data Source
AI summary
A device package may include a package substrate, a package cover disposed on the package substrate, and an integrated cooling assembly disposed between the package substrate and the package cover. The package cover generally has an inlet opening and an outlet opening disposed there through. The integrated cooling assembly includes a semiconductor device and a cold plate attached to the semiconductor device. The device package may include a material layer between the package cover and the cold plate. The cold plate may include a patterned first side and an opposite second side. The patterned first side may include a base surface and sidewalls extending downward from the base surface, where the base surface is spaced apart from the semiconductor device to collectively define a coolant channel. Here, the coolant channel is in fluid communication with the inlet opening and the outlet opening through openings disposed through respective portions of the material layer.