Embedded Magnet Frame Structure for Miniaturized Integrated Packaging
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Solution Overview
Problem
Current surface mounting processes for magnetic devices result in larger packaged devices, failing to meet miniaturization and high integration requirements, and increase production costs due to secondary mounting needs.
Innovation Solution
An embedded magnet frame and integrated structure with a manufacturing method involving conductive metal columns, sacrificial blocks, and dielectric layers, where a magnetic slurry is filled into cavities within a bearing plate to form an embedded magnet frame, eliminating the need for secondary mounting and reducing production processes and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If surface mounting process is used for packaging magnetic devices, then the packaging method is simple, but the packaged device volume becomes larger and cannot meet miniaturization requirements
Solution Approach 1:
The patent merges the magnet and frame into a single integrated structure by embedding the magnet directly into the frame during the same manufacturing process, eliminating the need for separate surface mounting operations. This integration reduces the overall packaged device volume while maintaining manufacturing simplicity through process consolidation rather than simplification.
Solution Approach 2:
The magnet is nested within the frame structure by embedding it into cavities formed in the frame body. This nesting approach allows the magnet to be contained within the overall device footprint, reducing the external volume required for the packaged device while the frame provides structural containment and support.
2Productivity
If surface mounting process is used for packaging magnetic devices, then the initial packaging is simple, but secondary surface mounting is required which increases production process and costs
Solution Approach 1:
The magnet is preliminarily positioned and embedded into the frame during the frame manufacturing process itself, before the frame is completed and before any mounting operations are performed. This preliminary action eliminates the need for subsequent secondary mounting operations, improving productivity by reducing the total number of manufacturing steps while the embedded structure maintains precision through integrated fabrication.
3Volume of moving object
If magnet is embedded within the frame during manufacturing, then miniaturization and high integration are achieved, but the manufacturing process becomes more complex
Solution Approach 1:
The manufacturing processes for the frame and magnet embedding are merged into a single integrated manufacturing flow. The frame is fabricated with embedded cavities, and the magnet is positioned and secured within these cavities during the same manufacturing cycle, achieving miniaturization without requiring separate complex assembly processes for magnet insertion and alignment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The embedded magnet frame allows for miniaturization and high integration of packaged products while saving production processes and costs by embedding the magnet within the frame during manufacturing, preventing alignment deviations and improving product yield.
Implementation Method 1
forming, according to the patterns, the conductive metal columns, the first sacrificial block and the second sacrificial block by electroplating
Implementation Method 2
filling the magnetic slurry into the first mounting cavity by means of screen printing, and solidifying, grounding and polishing the magnetic slurry to form the embedded magnet
Data Source
AI summary
An embedded magnet frame, an integrated structure and a manufacturing method are disclosed. The manufacturing method includes: manufacturing conductive metal columns, a first sacrificial block and a second sacrificial block on a surface of a bearing plate; laminating a first dielectric layer on the surface of the bearing plate so that the first dielectric layer covers the conductive metal columns, the first sacrificial block and the second sacrificial block; thinning the first dielectric layer to expose surfaces of the conductive metal columns, the first sacrificial block and the second sacrificial block; etching the first sacrificial block and the second sacrificial block to form corresponding first and second mounting cavities, the second mounting cavity being used for mounting a chip; filling the first mounting cavity with magnetic slurry to form an embedded magnet; and removing the bearing plate to form an embedded magnet frame.