Embedded Magnet Stack in Component Carriers for Thermal Stability
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Solution Overview
Problem
The challenge lies in creating a component carrier with magnetic functionality that is both mechanically robust and electrically reliable, capable of withstanding harsh conditions and high temperatures, while also being compact and suitable for miniaturization of electronic devices such as DC/DC converters and wireless charging systems.
Innovation Solution
A component carrier is designed with a laminated base material stack incorporating electrically conductive and insulating layers, embedded with a magnet stack composed of nanocrystalline magnetic layers and thermally stable epoxy bonding layers, which provides high magnetic permeability and mechanical stability, allowing for the integration of magnetic functionality within printed circuit boards and other component carriers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If magnetic functionality is integrated into component carriers, then magnetic performance is improved, but mechanical robustness deteriorates due to brittleness of magnetic materials
Solution Approach 1:
The magnetic core is divided into multiple thin magnetic layers (each 5-50 μm thick) that are stacked and bonded together. This segmentation allows the brittle magnetic material to be handled in manageable thin sheets while achieving the required total thickness and magnetic performance when assembled into a stack, resolving the mechanical fragility issue.
Solution Approach 2:
The patent creates a composite structure by bonding magnetic layers with adhesive layers to form a magnet stack. This composite approach combines the magnetic properties of the magnetic material with the mechanical strength and flexibility of the adhesive material, achieving both magnetic functionality and mechanical robustness.
2Reliability
If multiple magnetic layers are stacked to achieve required thickness, then magnetic performance is improved, but manufacturing complexity increases
Solution Approach 1:
The magnetic layers are pre-cut to the required shape and size before stacking. This preliminary preparation allows for precise positioning and simplifies the assembly process, as the layers can be directly stacked in the correct configuration without requiring complex alignment procedures during manufacturing.
Solution Approach 2:
Adhesive layers are introduced as intermediaries between the magnetic layers to bond them together. This intermediary approach simplifies the manufacturing process by providing a straightforward bonding mechanism that does not require complex joining techniques, while still achieving strong mechanical and thermal bonding.
3Strength
If thin magnetic layers are used to avoid damage, then mechanical stability is improved, but total magnetic volume decreases
Solution Approach 1:
The patent transitions from using a single thick magnetic layer to stacking multiple thin layers in the vertical dimension. This dimensional approach allows achieving the required total magnetic volume through accumulation of multiple thin layers, while each individual layer remains thin enough to maintain mechanical stability and avoid damage during handling.
4Strength
If adhesive layers are used to bond magnetic layers, then mechanical integrity is improved, but thermal stability deteriorates due to adhesive degradation
Solution Approach 1:
The patent specifies adhesive layers with particular thermal properties, requiring them to remain stable at temperatures of at least 300°C. This parameter change approach selects adhesives whose thermal degradation temperature exceeds the maximum processing temperature, ensuring both mechanical bonding integrity and thermal stability during manufacturing processes like reflow soldering.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the creation of compact, high-performance electronic devices with enhanced magnetic properties and thermal stability, facilitating the miniaturization of components like DC/DC converters and wireless charging systems without compromising mechanical integrity or stability.
Implementation Method 1
a magnet stack comprising a plurality of magnetic layers and at least one bonding layer in between, wherein each of the at least one bonding layer bonds two respectively neighbored magnetic layers
Implementation Method 2
the planar magnetic layers include a nanocrystalline magnetic material
Implementation Method 3
each bonding layer is thermally stable at least up to 300° C.
Data Source
AI summary
A component carrier includes a base material stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a magnet stack with a plurality of magnetic layers and at least one bonding layer, each of the at least one bonding layer bonding two respectively neighboured magnetic layers, wherein the magnet stack is embedded in the base material stack.