Embedded Magnetic Component With Solid Isolation Barrier
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Solution Overview
Problem
Existing embedded magnetic component devices face challenges in achieving high isolation performance due to the limitations of air-based isolation, which increases device size and is prone to contamination and arcing issues, especially when dealing with high voltages like 250 Vrms, where large spacing is required to meet safety standards.
Innovation Solution
The solution involves an embedded magnetic component device with a toroidal cavity and magnetic core, where a first and second isolation barrier are formed using insulating layers to create a solid bonded joint, reducing the isolation distance between primary and secondary windings to 0.4 mm, and the use of conductive connectors with varying spacings and cross-sectional areas to enhance electrical connections and reduce capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If air-based isolation is used between primary and secondary windings, then device size increases to meet safety spacing requirements, but isolation performance deteriorates due to contamination and arcing issues
Solution Approach 1:
The patent introduces a solid bonded joint structure as an intermediary between primary and secondary windings, replacing air-based isolation. This solid dielectric barrier provides reliable electrical isolation while reducing the required spacing to 0.4 mm, eliminating contamination and arcing issues associated with air gaps.
Solution Approach 2:
The patent changes the physical state of the isolation medium from gas (air) to solid (bonded dielectric material). This parameter change enables reduced isolation distance while maintaining or improving isolation performance, as the solid material provides better dielectric strength and contamination resistance.
2Reliability
If large spacing is provided between windings to meet safety standards for high voltages, then isolation performance improves, but device size and weight increase
Solution Approach 1:
The patent changes the isolation medium from air to solid bonded dielectric material, enabling reduced spacing to 0.4 mm while maintaining isolation performance. This compact design significantly reduces device weight compared to traditional designs requiring large air gaps for 250 Vrms safety standards.
Solution Approach 2:
The patent employs composite construction with solid dielectric materials bonded between windings, creating a compact structure that provides both mechanical support and electrical isolation. This composite approach eliminates the need for heavy spacing structures while meeting safety requirements.
3Volume of stationary object
If solid bonded joint is used to reduce isolation distance, then device size decreases, but manufacturing complexity increases
Solution Approach 1:
The patent merges the isolation barrier function with the structural bonding function into a single solid bonded joint. This integration eliminates the need for separate air gap maintenance and provides robust mechanical attachment, simplifying the overall manufacturing process despite the reduced tolerance requirements.
Data Source
AI summary
A magnetic core is situated in a cavity routed into an insulating substrate. The cavity and magnetic core are coved with a first insulating layer. Through holes are then formed through the first insulating layer and the insulating substrate, and plated to form conductive vias. Metallic traces are added to the exterior surfaces of the first insulating layer and the insulating substrate to form upper and lower winding layers. The metallic traces and conductive vias define the respective primary and secondary side windings for an embedded transformer. At least a second set of the outer conductive vias, are spaced farther from the cavity than a first set, and have greater via hole diameter than the vias in the first set. This reduces the resistance of the windings for a given substrate size and improves the performance of the device.